• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Analog IC Tips

Analog IC Design, Products, Tools Layout

  • Products
    • Amplifiers
    • Clocks & Timing
    • Data Converters
    • EMI/RFI
    • Interface & Isolation
    • MEMS & Sensors
  • Applications
    • Audio
    • Automotive/Transportation
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • FAQs
    • EE Learning Center
    • EE Training Days
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • White Papers
  • Video
    • EE Videos
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

4 GHz elastomer socket Introduced for BGA1440 with –1 dB insertion loss

October 1, 2025 By Aimee Kalnoskas Leave a Comment

Ironwood Electronics introduces a new elastomer-based socket solution targeting high-frequency BGA devices. The 94 GHz elastomer socket is designed for BGA1440 packages and enables signal paths with roughly –1 dB insertion loss at 94 GHz between each ball and the printed circuit board. The socket employs a swivel-lid compression mechanism to simplify device insertion and retention, and includes a heatsink and fan assembly to maintain device junction temperatures below 100 °C.

The socket’s interconnect architecture uses an elastomer matrix that provides per-signal continuity with low resistance and controlled signal integrity. Insertion loss at 94 GHz is maintained at approximately –1 dB, enabling high-bandwidth test of advanced devices. The mechanical interface consists of a swivel lid that presses the BGA into contact with the elastomer under controlled force, ensuring repeatable contact without requiring solder. The thermal management subsystem supports dissipation of up to 75 W of device heating, and the active cooling (fan plus heatsink) enforces a junction ceiling of 100 °C under expected workloads.

Assembly is facilitated by alignment features and standard mounting holes, enabling integration onto target PCBs. The swivel-lid mechanism provides quick access to the device under test, and the compression scheme applies the required contact force without subjecting the underlying board to excessive stress. In combination, the elastomer interconnect, low-loss signal path, and thermal control enable high-frequency, high-power device validation in a removable socket form rather than permanent soldered connection.

This product extends Ironwood’s capability in high-frequency elastomer sockets, complementing existing GHz series sockets that support pitches down to 0.3 mm and bandwidths beyond 40 GHz. The 94 GHz socket is aimed at advanced test and prototyping applications where access, performance, and thermal dissipation must coexist in a removable interface. Engineers working on mmWave, high-speed compute, and radar front-end devices may find the solution useful for validating device behavior across extremes of frequency and thermal load.

For additional technical details, datasheet requests, and integration support, contact Ironwood Electronics’ application engineering team.

 

You may also like:


  • 94 GHz BGA400 socket boasts 12 W power dissipation

  • Socket supports up to 40 GHz performance at –1 dB…

  • How to select automotive PCB-to-wire harness connectors

  • Elastomer socket combines thermal and RF power

Filed Under: IC sockets, PCB design, Products

Reader Interactions

Leave a Reply Cancel reply

You must be logged in to post a comment.

Primary Sidebar

Featured Contributions

High-Performance GPUs Are Located in a Variety of Environments, including Data Center Racks.

AI’s demand for faster, more reliable IC testing

Design a circuit for ultra-low power sensor applications

Active baluns bridge the microwave and digital worlds

Managing design complexity and global collaboration with IP-centric design

PCB design best practices for ECAD/MCAD collaboration

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: Connectivity
AI and high-performance computing demand interconnects that can handle massive data throughput without bottlenecks. This Tech Toolbox explores the connector technologies enabling ML systems, from high-speed board-to-board and PCIe interfaces to in-package optical interconnects and twin-axial assemblies.

EE LEARNING CENTER

EE Learning Center
“analog
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

EE ENGINEERING TRAINING DAYS

engineering

RSS Current EDABoard.com discussions

  • CST different result
  • question regarding specs for two types of components
  • Help with reading footprint
  • analyzing current limiting switch circuit
  • LLC controller has very poor current sense facility?

RSS Current Electro-Tech-Online.com Discussions

  • RC Electronic Speed Control Capacitors
  • Annex32 / Annex RDS For ESP Micros - A Quick and Dirty Example
  • Convenient audio FFT module?
  • CR2/CR123A Batteries In Projects
  • Harman Kardon radio module BMW noise
“bills

Footer

Analog IC Tips

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Battery Power Tips
  • Connector Tips
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

ANALOG IC TIPS

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2026 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy