Synopsys (has expanded its hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems based on the AMD Versal Premium VP1902 adaptive SoC. The HAPS-200 prototyping and ZeBu-200 emulation systems provide improved runtime performance, compile time, and debug productivity through their EP-Ready Hardware platform, which enables reconfiguration between emulation and prototyping use cases. […]
Elastomer socket combines thermal and RF power
To verify the performance of a high-power network processor chip, Ironwood Electronics’ 94+ GHz bandwidth elastomer socket can be used with a heatsink/axial flow fan to remove 135+ watts of heat generation. The elastomer socket is transparent, so the performance is equivalent to that of the direct solder version. The inductance of elastomer is 0.1nH, and […]
EE Training Days kicks-off 2025 with The A to Z of Multi-die Design
Did you know that multi-die architectures now represent over 50% of new semiconductor designs, marking a significant shift in chip development strategy? It’s true. There’s now a clear trend towards more multi-die designs, especially in data center, AI, and server applications where the complexity of the chips is too large to fit on a single […]
Eight-channel driver and photo receiver join precision IC family
Apex Microtechnology announced the addition of two new devices to its Precision IC product line: an 8-channel driver and a photo receiver amplifier IC. These devices join the family of nine linear amplifier ICs and four driver and sensor ICs, expanding the range of products providing supply voltages up to 350V with multi-channel architectures. The […]
Mixed-signal platform operates at 175° C for industrial use
onsemi has launched its Treo Platform, a new 65 nm BCD process integrates analog and mixed-signal functions operating from 1-90 V at temperatures up to 175° C. The process platform targets power management and sensing applications across automotive, medical, industrial and data center markets. The platform’s modular architecture helps customers streamline design processes and reduce […]
Electronics design platform integrates mechanical and software development
Altium announces three new products at electronica 2024, centered around a cloud-based electronics design and supply chain platform. The flagship product, Altium Discover, connects semiconductor manufacturers, distributors, and product developers through integrated workflow tools. Built on Altium 365’s cloud infrastructure, Discover enables real-time collaboration across the electronics supply chain. The platform features digital rights management […]
New collaboration brings industry-grade chip fabrication to Georgia Tech students
Georgia Institute of Technology’s School of Electrical and Computer Engineering (ECE) and Texas Instruments (TI) have announced a strategic collaboration to advance analog circuit education and prepare students for the growing demand in the semiconductor industry. The collaboration centers around the launch of a new course, ECE 4804: Analog VLSI (Very-Large-Scale Integration) I: Tapeout, which […]
Microphones available in 3.0 mm to 9.7 mm for diverse applications
Raltron announces the release of the RMIC Series, a new line of electret condenser microphones designed for various applications and features compact size, low power consumption, and a range of sensitivity and frequency response options. The microphones are available in sizes from 3.0mm to 9.7mm and offer omnidirectional, unidirectional, and noise-canceling options. Technical specifications include […]
High-bandwidth socket incorporates liquid cooling for heat dissipation
Ironwood Electronics has announced a high-power, liquid-cooled socket for multi-chip modules. Constructed with stamped spring pin technology to accommodate 15+GHz bandwidth along with liquid cooling for dissipating 40+ W to maintain temperature below 85 C. With the spring-loaded compression mechanism, swapping the device and characterizing it while maintaining thermal requirements is straightforward. .
Active baluns bridge the microwave and digital worlds
To achieve the datasheet performance of ultra-high-speed data converters, now clocking to 64 GS/sec, the handoff to and from the microwave domain must be near perfect. To preserve the data converters’ spurious-free dynamic range, a new category of component has been developed that converts between the differential and single-ended signal domains while amplifying and filtering […]
