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Andrew Zistler

EE analysis software integrates signal, power integrity, 3D-electromagnetic solving, and fast rule checking

April 5, 2016 By Andrew Zistler Leave a Comment

Mentor Graphics Corporation (NASDAQ: MENT) today announced its newest HyperLynx release which integrates signal and power integrity analysis, 3D-electromagnetic solving, and fast rule checking into a single unified environment. Based on the popular HyperLynx signal integrity/power integrity (SI/PI) application, this product for the first time offers designers a complete set of analysis technology sufficient for […]

Filed Under: Interface & Isolation Tagged With: mentorgraphics

Documentation-to-workflow package for PCB design tool

April 1, 2016 By Andrew Zistler Leave a Comment

Altium is scheduled to release a new documentation workflow available exclusively in their flagship PCB design platform, Altium Designer 16.1. Draftsman provides PCB designers with a unified documentation solution with customizable drawing views, documentation templates, and a fully complete design to documentation workflow in Altium Designer 16.1. Engineers interested in learning about all of the […]

Filed Under: Applications Tagged With: altium

X-Band front end IC includes dual Rx outputs

April 1, 2016 By Andrew Zistler Leave a Comment

Anokiwave, Inc. has announced it has extended its X-band IC product line with the addition of the AWMF-0106 Front End IC. This product release completes the family of X-band Radar solutions for commercial radar and 5G communications markets. The AWMF-0106 is an integrated power amplifier, low noise amplifier, limiter, and T/R switch intended to provide […]

Filed Under: Analog ICs Tagged With: anokiwave

Wireless Network Design Platforms account for building structures, floorplans, and terrain elevations

March 28, 2016 By Andrew Zistler Leave a Comment

EDX Wireless and Remcom announce the integration of SignalPro with Wireless InSite X3D ray-tracing beginning with the release of SignalPro version 8.3. The X3D model from Remcom uses GPU acceleration to greatly reduce calculation time. The model includes effects from reflections, diffractions, and transmissions and serves a variety of service area environments including urban, indoor […]

Filed Under: Applications, Wireless Tagged With: edx, remcom

Power inductors sport low loss over 2 to 5+ MHz range

March 25, 2016 By Andrew Zistler Leave a Comment

Coilcraft is introducing its new XEL40xx Series of low-loss power inductors today at the Applied Power Electronics Conference (APEC 2016) in Long Beach, CA. XEL40xx SeriesThe XEL40xx Series is offered with lower inductance values that have been fully optimized for high frequency applications. They also offer extremely low DCR (as low as 2.5 mOhms) and […]

Filed Under: Inductors Tagged With: coilcraft

Spice program handles 7 nm FinFETs

March 18, 2016 By Andrew Zistler Leave a Comment

Mentor Graphics Corporation (NASDAQ: MENT) has announced further enhancements and optimizations to the Calibre platform and Analog FastSPICE (AFS) platform by completing TSMC 10nm FinFET V1.0 certification. In addition, the Calibre and Analog FastSPICE platforms are ready for early design starts and IP design on TSMC’s 7nm FinFET process based on the most current Design […]

Filed Under: Analog ICs Tagged With: mentorgraphics

CMOS RF switch boasts cable-compatible linearity

March 18, 2016 By Andrew Zistler Leave a Comment

Peregrine Semiconductor Corp. has announced the UltraCMOS PE42723, an RF switch that boasts the highest linearity specifications on the market today. An upgraded version of the successful PE42722, this new RF switch offers enhanced performance in a smaller package. Like its predecessor, the PE42723 exceeds the linearity requirements of the DOCSIS 3.1 cable industry standard […]

Filed Under: RF Equipment Tagged With: peregrinesemiconductor

Chip capacitors span 1 to 33 nF with 1 kV ratings

March 17, 2016 By Andrew Zistler Leave a Comment

TDK Corporation has expanded its CGA lineup of high-voltage MLCCs for automotive applications. The new CGA6 and CGA9 series of MLCCs, which have a rated voltage of 1000 V, feature types with capacitances ranging from 1 nF to 33 nF, the world’s widest range*. The MLCCs are available with both C0G and NP0 temperature characteristics. […]

Filed Under: Applications, Products Tagged With: tdkcorporation

Low profile SMT disc shaped terminal

March 17, 2016 By Andrew Zistler Leave a Comment

Mill-Max is excited to announce a new addition to its family of spring pin mating products. This low profile SMT disc shaped terminal is perfect for applications where vertical space is at a premium. The new 1578-3-57-15-00-00-03-0 SMT disc is .078” (1,98 mm) in diameter and only .055” +/-.002” (1,4 mm +/- 0,0508 mm) tall. […]

Filed Under: Tools Tagged With: millmax

Wet Tantalum capacitors can handle 200°C

March 16, 2016 By Andrew Zistler Leave a Comment

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has extended its TWA-Y Series wet electrolytic tantalum capacitors with the addition of new, high CV 470µF/100V and 1,000µF/75V components. These components act as drop-in replacements for existing M39006-style wet tantalum capacitors in applications that may require operation at temperatures spanning 125°C to 200°C. […]

Filed Under: Analog ICs, Tools Tagged With: avx

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