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Andrew Zistler

Unity-gain difference amp precisely level shifts and buffers small difference signals, rejects up to ±270 V common mode

January 12, 2016 By Andrew Zistler Leave a Comment

Linear Technology introduces the LT6375, a unity-gain difference amplifier with integrated precision matched resistors, which precisely level shifts and buffers small difference signals while rejecting up to ±270V common mode. The A-grade version achieves unprecedented performance: CMRR is 97dB (min), initial gain error is 35ppm (max), gain drift is 1ppm/°C (max) and gain nonlinearity is […]

Filed Under: Amplifiers Tagged With: lineartechnology

Architectural flexibility and highly integrated protection from USB type C

January 11, 2016 By Andrew Zistler Leave a Comment

STMicroelectronics has announced a new solution for USB Type-C and Power Delivery with an interface IC aimed at clearing the “Rat’s Nest” of cables in the office and living room currently used to charge and connect computers, smartphones, tablets, TVs, set-top boxes, gaming platforms, and a broad range of consumer, industrial, and IoT smart devices. […]

Filed Under: Interface & Isolation Tagged With: STMicroelectronics

Bluetooth Smart SoC optimized for IoT device development

January 6, 2016 By Andrew Zistler Leave a Comment

Qualcomm Incorporated (NASDAQ: QCOM) has announced that its subsidiary, Qualcomm Technologies, Inc., has launched a new Bluetooth Smart 4.2 System-on-Chip (SoC) family specifically designed to help engineers meet the needs of today’s “always-on” world. The CSR102x family is optimized for specific applications in the Internet of Things (IoT), including wireless remote controls, simple smart watches, […]

Filed Under: IoT Tagged With: qualcomm

Time-of-Flight ranging sensor maximizes mobile-camera performance

January 6, 2016 By Andrew Zistler Leave a Comment

STMicroelectronics (NYSE: STM), has released its second-generation laser-ranging sensor based on its highly successful FlightSense technology. The new sensor, the VL53L0, can range faster, over longer distances, and more accurately, significantly improving smartphone- and tablet-camera performance and opening new possibilities and features in robotics, user detection, drones, IoT, and wearables. With its small form factor […]

Filed Under: IoT Tagged With: STMicroelectronics

3D image sensor chips bring virtual reality to smartphones

January 6, 2016 By Andrew Zistler Leave a Comment

In the future, mobile devices will be able to quickly and realistically detect their surroundings in three dimensions (3D). When they do, it will be thanks to the 3D image sensor chips from Infineon Technologies AG and pmdtechnologies gmbh. REAL3 will enable extremely realistic virtual and augmented reality game experiences that involve the interaction of […]

Filed Under: MEMS & Sensors Tagged With: infineon, pmd technology

Low-power sensor fusion platform seamlessly integrates into wearables

January 5, 2016 By Andrew Zistler Leave a Comment

Cadence Design Systems, Inc. (NASDAQ: CDNS) and CyweeMotion Ltd., today announced that CyweeMotion’s Sensor Fusion Hub™ software has been optimized for Cadence Tensilica Fusion digital signal processors (DSPs). This solution delivers a fully optimized, low-power sensor fusion platform for seamless integration into mobile or wearable devices. The Sensor Fusion Hub technology from CyweeMotion is sensor […]

Filed Under: MEMS & Sensors Tagged With: Cadence

Rad-tolerant 3.3V CAN transceivers for satcom apps

January 5, 2016 By Andrew Zistler Leave a Comment

Intersil Corporation today introduced the industry’s first radiation tolerant 3.3V controller area network (CAN) transceivers that are fully QML-V qualified and compliant with the ISO11898-2 physical layer standard. The three new ISL7202xSEH CAN transceivers provide reliable serial data transmission between a CAN controller and CAN bus at speeds up to 1Mbps. Up to 120 of […]

Filed Under: Analog ICs Tagged With: intersilcorporation

28nm Wi-Fi and Bluetooth/BLE combo for wearables, IoT, and smart home apps

January 5, 2016 By Andrew Zistler Leave a Comment

Marvell (NASDAQ:MRVL), a world leader in storage, cloud infrastructure, Internet of Things (IoT), connectivity and multimedia semiconductor solutions, today announced the advanced Avastar 88W8977 Wi-Fi and Bluetooth 4.2 (with future Bluetooth 5.0 features) low-power wireless System-on-Chip (SOC) designed to offer the smallest foot print and lowest bill of material (BoM) for the dynamic Wearables, Internet […]

Filed Under: IoT, Wireless Tagged With: marvell

Power efficient Bluetooth chip for wearable devices

January 5, 2016 By Andrew Zistler Leave a Comment

NXP Semiconductors N.V. (NASDAQ: NXPI) today introduced the world’s most power efficient Bluetooth Low Energy (BLE) System-on-a-Chip (SoC) solution. The new chip is 40 percent more energy efficient than its closest competitor and can deliver an unprecedented 2X times longer battery life for wearable and fitness tracking devices. The QN 9080 can run multiple applications […]

Filed Under: Wireless Tagged With: nxp

Flexible/Twistable waveguides operate to 40 GHz over nine frequency bands

December 29, 2015 By Andrew Zistler Leave a Comment

Pasternack is expanding their waveguide product portfolio with the addition of new flexible waveguides that operate up to 40 GHz over nine frequency bands. This offering consists of 36 unique models of flexible waveguide twists ranging in size from WR-137 (as low as 5.85 GHz) to WR-28 (up to 40 GHz). Pasternack’s flexible/twistable waveguides, also […]

Filed Under: RF Equipment Tagged With: pasternack

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