A new stamped-spring pin socket, CBT-QFE-3025, addresses high-performance requirements for testing 144-lead Quad flat pack packages. The contactor used in the CBT-QFE-3025 socket is a stamped-spring pin with a 17-gm actuation force per ball and a cycle life of 10,000+ insertions. The self inductance of the contactor is 0.88 nH, the insertion loss is less […]
Sockets handle 0.8-mm-pitch 20×20 array BGA327 packages
A new BGA socket design uses high-performance elastomer and is capable of 94 GHz signal handling, exhibits low inductance and works over a wide temperature range. The GT-BGA-2152 socket is designed for 17×17-mm packages and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed with […]
BGA266 sockets provide 30-GHz bandwidth without significant performance loss
A new high-performance BGA socket handles 0.65-mm pitch BGA 266-pin ICs. The SG-BGA-7335 socket is designed for 12×12-mm BGA packages and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The sockets is designed to dissipate up to 4 W with help from a heat-sinking compression screw. The contact […]
BGA BGA552 packages get 94-GHz sockets
A new BGA socket design uses a high-performance elastomer capable of 94 GHz, low inductance and wide temperature applications. The GT-BGA-2146 socket is designed for 20.6×19-mm package sizes and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed to dissipate 4.5 W using a heat […]
Small-to-large I/O sockets handle BGA chip testing tasks
New Grypper test sockets handle any BGA devices including large array ASICs and the smallest I/O down to 0.35-mm pitch. The Grypper socket can be designed to any I/O count specific to custom BGA requirements. The Ironwood Grypper G80 LIF socket, part number GR1005-XXXX, allows the testing of an 896-I/O, 31.0×31.0-pitch BGA package. This design […]
Clound platform connects PCB design users with software, suppliers
Nexar is a cloud-based partner platform designed to connect the rapidly growing community of Altium 365 PCB design users and their companies with the software, suppliers, and manufacturers needed to transform ideas into smart & connected products. Electronics industry researchers estimate there are 31 billion internet-connected devices in the world today, with consumer demand growing […]
Software accelerates design-to-manufacturing handoff for PCBs
PCBflow is an innovative cloud-based software solution which bridges the gap between the electronics design and manufacturing ecosystems. PCBflow extends Siemens’ Xcelerator portfolio with a secure environment for printed circuit board (PCB) design teams to interact with a variety of manufacturers, and by rapidly performing a range of design-for-manufacturing (DFM) analyses in the context of […]
Clamshell spring-pin socket handles Intel FBGA packages
A new BGA socket addresses high-performance requirements for FineLine Ball grid Array packages. The CBT-BGA-6111 socket has a contactor that is a stamped-spring pin with a 19-gm actuation force per ball and a cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss is less than 1 dB at […]
Spring-pin socket handles LGA104 packages
A new LGA socket addresses high-performance requirements for 0.52-mm-pitch LGA104 packages. Called the CBT-LGA-5031, it contains a contactor that is a stamped spring pin with 14-gm actuation force per pin and cycle life of 125,000 insertions. The self inductance of the contactor is 0.98 nH, insertion loss is below 1 dB at 10 GHz and […]
Clamshell-lid spring-pin socket holds QFN48 packages
A new QFN socket addresses high-performance requirements. The VQFN – CBT-QFN-7077 contactor is a stamped-spring pin with 31-gm/pin actuation force and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 15.7 GHz, and capacitance is 0.097pF. The current capacity of each contactor is 4 […]
