Capital Electra X is a new cloud-native electrical design software as a service (SaaS) offering aimed at individual electrical designers or small teams that require an affordable yet powerful electrical design solution. Part of the Siemens Xcelerator portfolio of software and services, Capital Electra X offers users sophisticated electrical design capabilities with lower cost-of-ownership and […]
CAD models cover timing, inductor products
SnapEDA, the first search engine for electronic design, and Abracon, an industry leader in passive components, have released over 13,000 new computer-aided design (CAD) models to help engineers design electronics faster. Designers spend weeks creating CAD models for their printed circuit board (PCB) designs. Besides being time-consuming, creating CAD models is a detailed and sophisticated […]
Stamped-spring pin socket accepts dual-row QFP packages
A new socket addresses high performance requirements for burn-in and test applications. The SBT-QFE-3035 socket includes a contactor that is a stamped spring pin with 14-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 20.5 GHz and […]
Audio component CAD models compatible with PCB design tools
An online experience allows engineers to visualize and download CAD models for PUI Audio products. To save engineers weeks of design work, SnapEDA created the first search engine focused on providing trustworthy electronics CAD (E-CAD) data. Traditionally, engineers have spent hours creating the CAD models needed for circuit board design. The process of creating and […]
“Zero-height” metric threaded inserts for PCBs
Ultra-Low-Profile, Surface Mountable Threaded Inserts now include Metric and Imperial thread options. These inserts are specifically designed and packaged for use on PCBs in the same manner as other SMT components as a simplified method of adding threads to PC Boards. Manufactured from steel with a tin plate, these inserts offer an easy method of […]
Circuit board shields feature short lead-time customization
Modified CBS products use existing tooling and manufacturing processes to create near-custom solutions with short lead times and little or no NRE, while providing all the same benefits of our CBS products. This allows for any parameter size and custom shapes to provide optimal shielding and save board space. Designs can include I/O holes, trace […]
Chip sockets handle flat no-lead SO-8 packages
A new high-performance elastomer socket for 1.27-mm-pitch QFN packages called the SG-MLF-7103 socket is designed for a 6.15×5.15-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
Sockets handle UFS and eMMC chip packages
New Grypper test sockets for eMMC and UFS BGA devices support the variety of sizes that 153 ball eMMC and UFS devices are produced, ranging from 7.5×7.5 mm to the 11.5×13.0 -0.50-pitch size. Ironwood Grypper socket, part number GR1135-XXXX, was designed for the new UFS 4.0 form factor of 153 BGA 11.0×13.0 – 0.50-pitch. To […]
Lever-actuated open-top spring pin socket for BGA256 packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA256 packaged devices. Called the CBT-BGA-6122, the socket’s contactor is a stamped spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and […]
Package converter technology allows use of SMT devices on through-hole PCBs
A new adapter for the three-pin TO-205AF packaged MOSFET device allows use of the equivalent product in an SOIC package to be used in PCBs developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip N-channel logic level MOSFET 2N6901. These adapters use an Ironwood-exclusive technology that allows a highly reliable and cost-effective […]
