Nichicon (America) Corp., an electronic components supplier and supplier of aluminum electrolytic capacitors, released the first episode of its newest video series, “Doctor Capacitor”, on its YouTube channel Wednesday. “Doctor Capacitor” follows its title character—an eccentric tech expert with a penchant for dry humor and a groovy decade long past—as he introduces viewers to the […]
Automated printed PCB design-for-manufacturing flow replaces traditional, manual error-prone processes
Valor NPI [New Product Introduction] design-for-manufacturing (DFM) technology is said to automate printed circuit board design reviews based on the PCB technology and manufacturing processes employed. Unlike traditional DFM methods that limited the use of DFM technology to subject-matter experts, the new Valor NPI is said to let designers benefit from DFM without having to […]
Socket handles 0.8-mm-pitch interstitial array, 609BGA packages
A new BGA socket design uses high-performance elastomer capable of 75 GHz while providing a low inductance and handling wide temperature ranges. The GT-BGA-2027 socket from Ironwood Electronics is designed for a 21×21-mm package and adds less than 1 dB of insertion loss. The socket is designed to dissipate few watts using aluminum components and […]
Advanced Circuits now has offshore division
PCB quick-turn manufacturer Advanced Circuits has created an offshore PCB sourcing division. The firm also has three U.S.-based manufacturing facilities offering flexible PCB quick-turn options and advanced capabilities along with in-house prototype assembly services. “Providing an offshore manufacturing solution for our customers is simply the affirmation of the processes we have built in-house over many […]
OSAT alliance program aims to streamline IC high-density advanced packaging design and manufacturing
The Mentor OSAT (Outsourced Assembly And Test) Alliance Program is being launched by Mentor, a Siemens company, to help drive ecosystem capabilities in support of new High-Density Advanced Packaging (HDAP) technologies like 2.5D IC, 3D IC and Fan-Out Wafer-Level Packaging (FOWLP) for customer IC designs. In launching the Alliance, Mentor says it will work with […]
Software addresses high-density advanced chip and board packaging flow
New software addresses the steps involved in advanced IC package design from rapid prototyping to GDS signoff. Developed by Mentor, a Siemens business, the Xpedition High-Density Advanced Packaging (HDAP) flow combines the Mentor Xpedition, HyperLynx, and Calibre technologies. The new Mentor IC package design flow is said to deliver faster, higher-quality results compared to existing […]
44-GHz bandwidth ATE Socket handles QFN48 packages
A new QFN socket design uses high-performance elastomer capable of 44 GHz, has low inductance, high endurance, and wide temperature applications. Developed by Ironwood Electronics, the SMP-QFN-8019 socket is designed for 9.1×14-mm packages and operates at bandwidths up to 44 GHz with less than 1 dB of insertion loss. The contact resistance is typically 15 […]
Elastomer sockets handle BGA packages
New high-performance elastomer sockets for 0.4-mm pitch BGA packages are designed for a 12×12-mm package size and operate at bandwidths up to 65 GHz with less than 1 dB of insertion loss (GSSG configuration). Developed by Ironwood Electronics, the SG25-BGA-2032 socket has a contact resistance of typically 20 mΩ/pin. Network analyzer reflection measurements for the […]
Stamped-spring pin socket addresses high-performance testing requirements
A new stamped-spring pin socket handles high-performance requirements for testing BGA1164 – CBT-BGA-7042. From Ironwood Electronics, the contactor is a stamped spring pin with 31-g actuation force/ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is < 1 dB at 15.7 GHz and capacitance is 0.097pF. The […]
Software 3D-simulates vibration, acceleration on PCB systems
A new vibration and acceleration simulation package for printed circuit board (PCB) systems is said to accurately predict results ordinarily available only through traditional, physical HALT (highly accelerated lifecycle testing). The Mentor Graphics Xpedition product is said to augment mechanical analysis and physical testing by introducing virtual accelerated lifecycle testing much earlier in the design […]
