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Lee Teschler

OPA388 zero-drift, zero-crossover op amp brings high precision

February 6, 2017 By Lee Teschler Leave a Comment

opa388

Billed as the first operational amplifier (op amp) to offer both zero-drift and zero-crossover technology, the OPA388 maintains high precision across the entire input range for a variety of industrial applications, including test and measurement, medical and safety equipment, and high-resolution data-acquisition systems. Developed by Texas Instruments, the OPA388 realizes ultra-high input linearity and precision. […]

Filed Under: Amplifiers, Analog ICs Tagged With: op amps, Texas Instruments

Finger stock EMI gaskets come in over 100 standard profiles

January 31, 2017 By Lee Teschler Leave a Comment

tech etch finger gaskets

EMI shielding BeCu finger stock gaskets from Tech-Etch are offered in over 100 standard profiles. Downloadable interactive sales drawings let users modify the strips to exact requirements. Beryllium copper’s mechanical and electrical properties make it a strong candidate material for EMI/RFI shielding, with over 100 dB attenuation. BeCu offers maximum spring properties for strength and […]

Filed Under: EMI/RFI, Products Tagged With: Tech-Etch

Miniature future for
passive electronic components

December 1, 2016 By Lee Teschler Leave a Comment

quartz-crystals

Jürgen Geier, Christian Kasper, Jochen Neller, Bert Weiss Rutronik Passive electronic components are getting smaller, but the are also providing better performance within the same form factor. Twenty years ago form factors such as 1812 and 1206 were widely used. Today’s most commonly specified sizes are 0603 and 0402. The range extends down to 01005 […]

Filed Under: Capacitors, Clocks & Timing, Inductors, Resistors Tagged With: rutronik

Sockets for 378-pin BGA packages
boast no significant performance loss

November 4, 2016 By Lee Teschler Leave a Comment

A new high-performance BGA socket for 0.61 x 0.635-mm pitch BGA 378-pin ICs called the SG-BGA-7303 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with a custom […]

Filed Under: Uncategorized

Free PCB design software gets an upgrade

November 2, 2016 By Lee Teschler Leave a Comment

Advanced Circuits has released version 3.2 of its free professional-grade PCB design software, PCB Artist, the most active PCB software on Downloads.com with over 265,000 downloads. Since its first release in June of 2007, Advanced Circuits’ PCB Artist has become well known in the printed circuit board industry as the best free PCB design software […]

Filed Under: Uncategorized

New software facilitates multi-discipline
collaboration for multi-board systems

October 24, 2016 By Lee Teschler Leave a Comment

New design software aims to enable a seamless concurrent collaboration among multi-discipline teams working on multi-board designs. Called Xpedition, the software was developed by Mentor Graphics Corp. It is said to eliminate redundant effort during the design process and to optimize product performance and reliability with a data management infrastructure. The result is better data […]

Filed Under: Software Tagged With: mentor graphics

Review: Advances in Body-Centric Wireless Communication, applications and state-of-the-art

August 8, 2016 By Lee Teschler Leave a Comment

body centric wireless

It is theoretically possible to solve Maxwell’s equations to characterize how an RF signal propagates some distance away from its transmitter, but that task is impossibly complex for most real applications. That’s why the usual ways of analyzing the propagation of RF signals, as used in cellular and other communication systems, is to rely on […]

Filed Under: Applications, IoT

PCB Product Creation Platform gets Advanced Analog/Mixed-Signal, High-Speed Analysis features targeting design Engineers

July 11, 2016 By Lee Teschler Leave a Comment

PADS

Mentor Graphics Corp. has made additions to its PADS PCB Product Creation Platform designed to address engineering challenges associated with mixed-signal design, DDR implementation, and electrically-correct design signoff. The additions consist of a new PADS AMS Design Suite, PADS AMS Cloud, PADS HyperLynx DRC, and PADS HyperLynx DDR modules. Combined with the recently announced PADS […]

Filed Under: Analog ICs, mixed-signal, PCB design, Software Tagged With: mentor graphics

Gallery: Electronics in the spotlight at Xponential 2016 unmanned systems exhibition

May 12, 2016 By Lee Teschler Leave a Comment

xponential 2016

Though the Xponential unmanned systems exhibition has a reputation for showing off a lot of exotic hardware, there were numerous developments on the electronics front at this year’s event. Themes we noticed included manufacturers paying more attention to the handling of huge data flows generated by optical and thermal sensors that sit onboard UAVs these […]

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Filed Under: Amplifiers, Applications, Clocks & Timing, Data Converters, Interface & Isolation, MEMS & Sensors Tagged With: analog devices, LCR, Leddar, Lind, MEN Micro, naval research lab, otto engineering, vectornav

Hybrid inks for flexible electronics need no sintering

April 26, 2016 By Lee Teschler Leave a Comment

Researchers at Rensselaer Polytechnic Institute (RPI) are building tools and developing a framework that developers can use to easily perform data analytics over a multitude of devices. Rather than having developers design custom algorithms for each network of devices, the framework of software RPI has in mind sits on all the network devices. The cloud […]

Filed Under: Applications, IoT, IoT, Products

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