New Grypper test sockets for eMMC and UFS BGA devices support the variety of sizes that 153 ball eMMC and UFS devices are produced, ranging from 7.5×7.5 mm to the 11.5×13.0 -0.50-pitch size. Ironwood Grypper socket, part number GR1135-XXXX, was designed for the new UFS 4.0 form factor of 153 BGA 11.0×13.0 – 0.50-pitch. To […]
Lever-actuated open-top spring pin socket for BGA256 packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA256 packaged devices. Called the CBT-BGA-6122, the socket’s contactor is a stamped spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and […]
Package converter technology allows use of SMT devices on through-hole PCBs
A new adapter for the three-pin TO-205AF packaged MOSFET device allows use of the equivalent product in an SOIC package to be used in PCBs developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip N-channel logic level MOSFET 2N6901. These adapters use an Ironwood-exclusive technology that allows a highly reliable and cost-effective […]
40-GHz-bandwidth sockets handle BGA121 chip packages
A new high-performance elastomer socket for 0.5-mm-pitch BGA packages, called the CG25-BGA-2002, is designed for a 6×6-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken with […]
Stamped-spring pin sockets handle BGA289 chip packages
A new socket addresses high-performance requirements for testing BGA289-packaged ICs.The contactor on the SBT-BGA-6577 socket is a stamped-spring pin with a 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. […]
Elastomer sockets handle high-bandwidth 0.508-mm pitch 132QFP packages
A new high-performance QFP socket for 0.508-mm pitch 132-pin QFP packages called the SG-QFE-7025 socket is designed for a 19.39×19.39×4.22-mm package size with 24.79×24.79-mm lead tip-to-tip and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ per I/O. The socket connects all […]
94-GHz BGA sockets handle Xilinx FFVB676 packages
A new BGA socket design uses high-performance elastomer capable of 94 GHz and features a low inductance for use in applications characterized by wide temperature ranges. The GT-BGA-2175 socket is designed for a 27×27-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is […]
Sockets handle BGA472 packages, perform like direct solder connections
A new BGA socket design uses high-performance elastomer capable of 94 GHz, features low inductance and handles wide temperature applications. The GT-BGA-2164 socket is designed for a 23×23-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed with a screw-down lid and […]
High-temperature spring-pin sockets handle LGA464 packages
A new LGA socket addresses high-performance requirements for 1.5-mm-pitch LGA464 packages. The CBT-LGA-5037 socket’s contactor is a stamped-spring pin with 19-gm actuation force/pin and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss is < 1 dB at 23 GHz, and capacitance is 0.097 pF. The current capacity of […]
Precision P-Channel MOSFET array designed for extremely low power, mostly-on apps
The first-to-market nano-power precision P-Channel EPAD MOSFET array comprises a matched-pair circuit is designed for the next generation of products requiring extremely low power applications and mostly-on operation. This MOSFET simplifies bias circuitry while optimizing power usage. Market segments using the MOSFET array are energy harvesting systems, automotive, medical, transportation, robotics, and any wireless product. […]
