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Artificial Intelligence

Understanding ADC specs and architectures: part 1

April 9, 2025 By Rick Nelson

Analog-to-digital converters are the heart of most test equipment, setting the stage for the digital processing of analog signals. Several posts over the past year or so have involved digital signal processing. For example, we have covered the fast Fourier transform (FFT), the inverse FFT, and discrete convolution. To perform these operations on real-world signals, […]

Filed Under: Artificial Intelligence, Data Converters, FAQ, Featured Tagged With: FAQ

9 mm square module achieves -100 dBm receive sensitivity

March 12, 2025 By Redding Traiger

Insight SIP is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge. It can thus form the core of a complex IOT device with an unparalleled mixture of features, performance, and […]

Filed Under: Artificial Intelligence, Events, IoT, Products, Tools Tagged With: insightsip

How AI and ML optimize functional verification for EDA

January 22, 2025 By Aharon Etengoff

Functional verification ensures that the register transfer layer (RTL) implementation of semiconductor designs operates according to specified requirements. Electronic engineers typically perform functional verification using hardware verification languages (HVLs) such as SystemVerilog paired with the universal verification methodology (UVM). Other HVLs, such as VHSIC Hardware Description Language (VHDL) and Property Specification Language (PSL), may be […]

Filed Under: Artificial Intelligence, EDA, FAQ, Featured Tagged With: FAQ

EE Training Days kicks-off 2025 with The A to Z of Multi-die Design

January 21, 2025 By Aimee Kalnoskas

Did you know that multi-die architectures now represent over 50% of new semiconductor designs, marking a significant shift in chip development strategy? It’s true. There’s now a clear trend towards more multi-die designs, especially in data center, AI, and server applications where the complexity of the chips is too large to fit on a single […]

Filed Under: Analog ICs, Applications, Artificial Intelligence, Automotive/Transportation, Data Center, EE Training Days 2025, Featured, Industry Experts Tagged With: multi-die design, synopsys

What are the different types of AI accelerators?

December 18, 2024 By Aharon Etengoff

Whether in data centers or at the edge, artificial intelligence (AI) accelerators address the limitations of traditional von Neumann architecture by rapidly processing massive datasets. Despite the gradual slowing of Moore’s law, these accelerators efficiently enable key applications such as generative AI (GenAI), deep reinforcement learning (DRL), advanced driver assistance systems (ADAS), smart edge devices, […]

Filed Under: Artificial Intelligence, FAQ, Featured Tagged With: FAQ

How do generative AI, deep reinforcement learning, and large language models optimize EDA?

December 4, 2024 By Aharon Etengoff

Artificial intelligence (AI) and machine learning (ML) are playing an increasingly crucial role in optimizing electronic design automation (EDA) across the semiconductor industry. This article explores the rising complexity and costs of designing chips at advanced nodes. It highlights how generative AI (GenAI) and deep reinforcement learning (DRL) help semiconductor companies accelerate time to market […]

Filed Under: Artificial Intelligence, EDA, FAQ, Featured Tagged With: FAQ

AI design platform links engineers to electronic component options

November 13, 2024 By Redding Traiger

CELUS announced the global release of its AI-assisted hardware design platform that helps engineers identify components for their projects through algorithms and machine learning. The CELUS Design Platform converts technical requirements into schematic prototypes, reducing the electronics design timeline to under an hour. The platform enables developers and engineers to move electronics projects from concept to […]

Filed Under: Artificial Intelligence, Software, Tools Tagged With: celus

Electronic design platform connects cloud resources to PCB workflows

November 13, 2024 By Redding Traiger

Siemens Digital Industries Software has announced the latest advancement in its electronic systems design portfolio. The new release integrates Xpedition software, Hyperlynx software, and PADS Professional software into a unified user experience with cloud connectivity and AI capabilities to advance innovation in electronic systems design. The electronic systems design industry faces challenges including engineering talent shortages, […]

Filed Under: Artificial Intelligence, Connectivity, PCB design, Products, Software, Tools Tagged With: siemensdigitalindustries

Mixed-signal platform operates at 175° C for industrial use

November 11, 2024 By Aimee Kalnoskas

onsemi has launched its Treo Platform, a new 65 nm BCD process integrates analog and mixed-signal functions operating from 1-90 V at temperatures up to 175° C. The process platform targets power management and sensing applications across automotive, medical, industrial and data center markets. The platform’s modular architecture helps customers streamline design processes and reduce […]

Filed Under: Analog ICs, Applications, Artificial Intelligence, Automotive/Transportation, Data Center, electronica 2024, Events, Industrial, Medical, mixed-signal Tagged With: onsemi

AI-driven technology automatically identifies and addresses EM-IR violations

November 3, 2023 By Redding Traiger

Cadence Design Systems, Inc. announced the new Cadence Voltus InsightAI, the industry’s first generative AI technology that automatically identifies the root cause of EM-IR drop violations early in the design process and selects and implements the most efficient fixes to improve power, performance, and area (PPA). Using Voltus InsightAI, customers can fix up to 95% […]

Filed Under: Artificial Intelligence, Products, Software, Tools Tagged With: cadencedesignsystems

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