Knowles Precision Devices introduced a newly expanded range of safety-certified surface mount multilayer ceramic capacitors (MLCCs) for electronic device applications. The new capacitors offer customers a unique combination of capability and safety certification and meet the demands of AEC-Q200 standards, modems, and AC-DC power supplies where a lightning strike or other voltage transients represent a threat […]
Automotive/Transportation
Chip inductors designed for automotive audio bus apps
Bourns, Inc. announced its new 1210-size automotive-grade common-mode chip inductor series. Bourns’ latest family of common-mode inductors are designed with a ferrite core and are bifilar-wound to deliver a compact size and shielded construction. The Model SRF3225AB and SRF3225TAC common-mode chip inductor series offer low radiation and high impedance over a broad frequency range to suppress Electromagnetic […]
High-res audio amp designed for automotive apps
The HFDA801A from STMicroelectronics is a high-resolution audio amplifier that is specifically designed for compact, cost-effective automotive applications. The HFDA801A is a 2MHz switching pulse-width modulation (PWM) Class-D amplifier with a quad-bridge configuration. An integrated high-performance digital-to-analog converter (DAC) ensures hi-fi quality sound under any load condition, with noiseless turn-on/turn-off and without creating any output artifacts. With a signal-to-noise […]
APD and SPAD devices now offer boosted photon-detection performance and increased active area
X-FAB Silicon Foundries has just introduced its latest generation of avalanche photodiode (APD) and single-photon avalanche diode (SPAD) devices. Leveraging its proven automotive-qualified 180 nm XH018 high-voltage process, X-FAB’s new APDs and SPADs benefit from innovative architectural modifications, with substantial improvements in performance exhibited compared with the company’s earlier devices (which were initially announced back […]
MLCCs sport 1.0 µF ±20% values for 4-Vdc-rated automotive apps
Murata announced the ultra-thin LW reversed, low equivalent series inductor (ESL) multilayer ceramic capacitor (MLCC) with a capacitance value of 1.0 µF ±20% for 4 Vdc-rated automotive applications. With a 0204-inch size (0.5 x 1.0 mm) footprint and a maximum thickness of just 0.22 mm, the LLC152D70G105ME01 decoupling capacitor can be implemented on the back […]
Metamaterials’ potential for transforming electronics
Metamaterials are engineered/manmade materials with properties not found in nature. The emergence of metamaterials is expected to have a significant impact on a variety of electronics applications. These unnatural materials could have an impact similar to “MEMS” (micro-electromechanical system) technology, with the potential to bring transformational changes. This initial FAQ will briefly look into possible […]
Two-wire, hall effect switches operate over -40 C to 150 C
Diodes Incorporated has announced a family of automotive-compliant, two-wire unipolar (AH323xQ/4xQ) and latch (AH327xQ/8xQ) switch integrated circuits (ICs) that provide high sensitivity and high stability over wide operating voltage and temperature ranges. The ICs are for use in automotive proximity- and position-sensing applications, including seatbelt buckle, power window, gear selector, and seat position. The adoption […]
Ultra-thin decoupling MLCCs for 4 Vdc-rated automotive apps
Murata introduces the ultra-thin LW reversed, low equivalent series inductor (ESL) multilayer ceramic capacitor (MLCC) with a capacitance value of 1.0 µF ±20% for 4 Vdc-rated automotive applications. With a 0204-inch size (0.5 x 1.0 mm) footprint and a maximum thickness of just 0.22 mm, the LLC152D70G105ME01 decoupling capacitor can be implemented on the back […]
High-performance external antennas cover, GNSS, LTE, WiFi, GPS bands
AVX Corporation announces Ethertronics’ extensive range of high-performance, high-reliability external antennas designed to provide immediate, standardized solutions for a wide range of cross-market applications with challenging space, weight, and performance requirements. The nine antenna series offers a wide variety of small, low-profile form factors ruggedized and environmentally sealed for use in heavy-duty and harsh-environment applications. […]
Multilayer chip NTC thermistors mount via conductive adhesion
TDK Corporation announces the development of new chip NTC thermistors designed for conductive adhesion mounting, expanding TDK’s NTCSP series product lineup. The chip NTC thermistors are used for temperature sensing and compensation, measuring without direct contact in automotive applications including ABS, inside the transmission or engine, and more. The new NTCSP series part numbers are […]
