ON Semiconductor has announced a complete wireless battery-free sensing solution kit (SPSDEVK1) that allows the company’s innovative Smart Passive Sensors (SPS) to be rapidly integrated into Internet-of-Things (IoT) applications. The SPSDEVK1 solution kit is plug and play ready for users to immediately measure, aggregate and analyze the data for various IoT applications. SPS wireless and battery-free sensors enable the monitoring of […]
IoT
Intertial measurement units designed for autonomous machine navigation
Analog Devices, Inc. announced a series of five high-performance inertial measurement units (IMUs) that address the navigation- and safety-related needs of industrial applications in several emerging markets, while also reducing their system complexity and cost. The ADIS16470, ADIS16475 and ADIS16477 IMUs are optimized to provide a range of performance, cost, and application-suitability needs. The ADIS16465 and […]
Mixed-signal ICs promise up to 80% system cost savings; online calculator creates estimates in under a minute
S3 Group, a global technology group operating in the semiconductor and connected health industries, has announced a change in strategy for its custom semiconductor business, S3 Semiconductors (S3semi). It will now focus on industrial and communications OEMs, converting their electronic systems and boards into mixed-signal integrated circuits and delivering packaged and tested chips, rather than […]
Zero-drift op amp consumes just 1.3 μA
Analog Devices, Inc. announces the LTC2063 zero-drift op amp which draws just 1.3μA typ (2μA max) on a 1.8V supply. This micropower amplifier maintains uncompromised precision: maximum input offset voltage is 5μV at 25°C, maximum drift is 0.06μV/°C from –40°C to 125°C. Maximum input bias current is 15pA at 25°C, and 100pA from –40°C to […]
Plugfest interoperability testing event for early adopters of new MIPI I3C sensor interface
The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the successful completion of its first MIPI I3CSM Plugfest interoperability event. The plugfest, held March 27-28 in Barcelona, Spain, in conjunction with the MIPI Alliance Member Meeting, provided the first opportunity for early adopters of the new MIPI I3C sensor interface to […]
RF switches optimize transceiver performance in communication applications
CEL is introducing a variety of new RF switches that have been designed as easy drop in replacements for a wide range of existing RF products as well as for new designs. Target markets include test and measurement systems as well as Wi-Fi, ZigBee and Bluetooth routers, sensors, appliances, and other radio-equipped products. RF (Radio […]
Crystal units allow for higher-density mounting and use in low profile, IoT devices
Murata Americas today introduced several miniaturized, highly advanced crystal units developed specifically for the IoT market. The company used its proprietary technology and volume production capability to design a product line that excels in quality and reliability, while also providing a cost effective solution. The series features a compact package that allows for higher-density mounting and use in lower profile devices. Target applications include IoT, mobile […]
The 10 most popular posts on Analog IC Tips for 2016
We went into our article archives to uncover the most widely read posts on analogictips.com over the past 12 months. Here for your reading (or re-reading?) pleasure are the top 10 stories: How IoT and mixed signal designs will drive SiP tech in 2016 How much math do you need to know to design electronics? […]
Super-thin ceiling/Wall-Mounted Wideband Antennas cover 600 to 3800 MHz
Laird’s new CFS Low Passive Intermodulation (PIM) Ultra-Low profile antennas – just seven millimeters thick, or about half the thickness of a smartphone – improve in-building wireless telecommunications and deliver consistent, reliable Internet connectivity, further enabling the Internet of Things (IoT). Because they are so thin and require eight to 40 percent less wall or […]
Partnership announced to develop low-power AFEs for next-gen home access and industrial automation products
MegaChips Corporation, a global semiconductor company specializing in ASICs and Application Specific Standard products (ASSPs), and Omni Design Technologies, a provider of high-performance, ultra-low power semiconductor IP cores, today announced a strategic partnership for the development of high-performance, low-power analog front end (AFE) chips. This partnership brings together two industry leaders with the joint purpose […]
