Wireless communication has been around since the 18th century when James Clerk Maxwell first proposed that electromagnetic waves can be generated and can travel through free space. Heinrich Rudolf Hertz conducted the experiments in which he demonstrated the generation, transmission, and reception of electromagnetic waves, which became the basis of Radio Frequency communication. Wireless communication […]
Applications
Input bias current cancellation in bipolar op amps
Bipolar operational amplifiers have an essential input bias current requirement. This bias current has to come from somewhere and can be a nuisance in some types of high impedance circuits such as charge amplifiers and transimpedance amplifiers and can result in offset voltages where input resistances aren’t matched. The example shown below has an input […]
4-channel, ESD device for high-speed interfaces protects automotive and video link applications
Nexperia has announced a new range of ESD protection devices aimed specifically at protecting the ever-increasing number of high-speed interfaces found in automotive applications, especially the in-vehicle networks (IVN) associated with infotainment and vehicle communications. As data rates increase and vehicles feature more electric content, the need for EMC protection becomes more critical, and providing […]
Unified, circuit simulation workflow incorporates fast SPICE engines to accelerate hyper-convergent designs
Today’s hyper-convergent SoCs consist of larger and faster-embedded memories, analog front-end devices, and complex I/O circuits that communicate at 100Gb+ data rates with the DRAM stack connected on the same piece of silicon in a system-in-package design. These challenges associated with verifying these complex designs scale as advanced technology process nodes present increased parasitics, process […]
Thick-film chip resistor arrays comply with AEC-Q200 standard
Bourns, Inc. announced several new AEC-Q200 compliant thick film chip resistor array model families. Bourns designed the new surface-mount model CATxxA-LF, CAYxxA-LF, and CAYxxA-AS series to help increase available board space and reduce costs. Offering long-life protection against many sulfurous environments, the Model CAYxxA-AS series is the first chip arrays from Bourns that meet both the AEC-Q200 […]
Interference suppression caps operate to 125 °C
TDK Corporation presents a new series of EPCOS MKP-X2 capacitors for interference suppression. In contrast to conventional models, which are designed for a maximum operating temperature of 110 °C, the new capacitors offer a maximum permissible operating temperature of 125 °C. The capacitance range of the B3292*P series ranges from 0.033 µF to 5.6 µF, […]
Front-haul ICs drive 50 Gbps PAM4 5G wireless optical modules
Semtech Corporation announced sampling of the newest member of its Tri-Edge CDR portfolio, the GN2256. Integrating Semtech’s proven Tri-Edge CDR platform with a differential EML (Externally Modulated Laser) driver, the GN2256 is the industry’s first such IC solution to enable 50Gbps PAM4 Fixed-WDM (Wavelength Division Multiplexing), Tunable WDM and Silicon Photonics optical modules. As with all […]
Evaluation kit simplifies design of battery-powered, smart-home products
Aspinity announced the availability of its Acoustic Event Detection Kit (EVK1) for battery-operated, smart home devices that are always listening for acoustic triggers such as window glass breaks, voice, or other acoustic events—delivering the essential technology that helps keep homes and families safe and secure. Featuring the company’s analogML core—a fully analog machine learning processor […]
HIgh-frequency, high-bandwidth RFICs and MMICs target RF and microwave
CML Microcircuits has announced the SµRF, a new range of high frequency, high bandwidth RFICS and MMICs targeting RF and mmWave applications. As wireless communications move further into the GHz range, the need for high-quality RF building blocks to enable high bandwidth and low latency is growing rapidly. The global demand for faster downloads and […]
A comparison of EMI test setups and specifications for automotive, industrial and defense applications, part 2: Radiated emissions
By Timothy Hegarty, Applications Engineer, Texas Instruments This article compares electromagnetic compatibility (EMC) requirements in automotive, industrial and defense product family standards, specifically various test parameters, test equipment, test setups and test methods for radiated emissions (REs). Much like the treatment of conducted emissions [1] in part 1 of this two-part article series, the comparison […]