Did you know that multi-die architectures now represent over 50% of new semiconductor designs, marking a significant shift in chip development strategy? It’s true. There’s now a clear trend towards more multi-die designs, especially in data center, AI, and server applications where the complexity of the chips is too large to fit on a single […]
Applications
What are the different types of AI accelerators?
Whether in data centers or at the edge, artificial intelligence (AI) accelerators address the limitations of traditional von Neumann architecture by rapidly processing massive datasets. Despite the gradual slowing of Moore’s law, these accelerators efficiently enable key applications such as generative AI (GenAI), deep reinforcement learning (DRL), advanced driver assistance systems (ADAS), smart edge devices, […]
Tiny logic ICs target auto safety and ADAS markets
Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturized logic ICs are essential for space-constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS). MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB […]
How do generative AI, deep reinforcement learning, and large language models optimize EDA?
Artificial intelligence (AI) and machine learning (ML) are playing an increasingly crucial role in optimizing electronic design automation (EDA) across the semiconductor industry. This article explores the rising complexity and costs of designing chips at advanced nodes. It highlights how generative AI (GenAI) and deep reinforcement learning (DRL) help semiconductor companies accelerate time to market […]
Eight-channel driver and photo receiver join precision IC family
Apex Microtechnology announced the addition of two new devices to its Precision IC product line: an 8-channel driver and a photo receiver amplifier IC. These devices join the family of nine linear amplifier ICs and four driver and sensor ICs, expanding the range of products providing supply voltages up to 350V with multi-channel architectures. The […]
AI design platform links engineers to electronic component options
CELUS announced the global release of its AI-assisted hardware design platform that helps engineers identify components for their projects through algorithms and machine learning. The CELUS Design Platform converts technical requirements into schematic prototypes, reducing the electronics design timeline to under an hour. The platform enables developers and engineers to move electronics projects from concept to […]
Electronic design platform connects cloud resources to PCB workflows
Siemens Digital Industries Software has announced the latest advancement in its electronic systems design portfolio. The new release integrates Xpedition software, Hyperlynx software, and PADS Professional software into a unified user experience with cloud connectivity and AI capabilities to advance innovation in electronic systems design. The electronic systems design industry faces challenges including engineering talent shortages, […]
Buzzers cut through background noise up to 100 dB
Raltron announces the release of the RBE Series of electromagnetic buzzers. Designed for applications requiring high Sound Pressure Level (SPL) buzzers and alarms, the RBE Series offers some of the loudest devices in the industry, making them ideal for smoke detectors and fire alarm systems, industrial control panels and equipment, medical devices and healthcare systems, security […]
Mixed-signal platform operates at 175° C for industrial use
onsemi has launched its Treo Platform, a new 65 nm BCD process integrates analog and mixed-signal functions operating from 1-90 V at temperatures up to 175° C. The process platform targets power management and sensing applications across automotive, medical, industrial and data center markets. The platform’s modular architecture helps customers streamline design processes and reduce […]
Virtual platform suite addresses chip design workflow
Siemens Digital Industries Software has released the Innexis product suite to complement its Veloce hardware-assisted verification and validation system. The Innexis suite addresses software development needs in early IC development phases through three core products. The suite enables hardware/software development flow from virtual to hybrid to full RTL, provides an architecture native virtual platform, and […]
