Insight SIP is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge. It can thus form the core of a complex IOT device with an unparalleled mixture of features, performance, and […]
Events
EE Training Days kicks-off 2025 with The A to Z of Multi-die Design
Did you know that multi-die architectures now represent over 50% of new semiconductor designs, marking a significant shift in chip development strategy? It’s true. There’s now a clear trend towards more multi-die designs, especially in data center, AI, and server applications where the complexity of the chips is too large to fit on a single […]
Mixed-signal platform operates at 175° C for industrial use
onsemi has launched its Treo Platform, a new 65 nm BCD process integrates analog and mixed-signal functions operating from 1-90 V at temperatures up to 175° C. The process platform targets power management and sensing applications across automotive, medical, industrial and data center markets. The platform’s modular architecture helps customers streamline design processes and reduce […]
Electronics design platform integrates mechanical and software development
Altium announces three new products at electronica 2024, centered around a cloud-based electronics design and supply chain platform. The flagship product, Altium Discover, connects semiconductor manufacturers, distributors, and product developers through integrated workflow tools. Built on Altium 365’s cloud infrastructure, Discover enables real-time collaboration across the electronics supply chain. The platform features digital rights management […]
