IC sockets

A new socket handles ASE package BGA 324 devices. The sockets use an elastomer technology as a contactor between the IC package and the circuit board. The elastomer can support +50 GHz bandwidth and comes with a protective cover. (The cover is necessary because the elastomers are sensitive to dirt.) The elastomer has a low […]

New sockets handle ball grid array devices with a 1,365 pin count and a 0.65-mm pitch. The socket utilizes a high-performance elastomer contactor and has over 40 GHz bandwidth with a -1 dB insertion loss. The self-inductance is 0.21 nH. Capacitance to ground is 0.15 pF. Current capacity is 4 A/pin. The socket operates over […]

A new socket addresses high performance requirements for burn-in and test applications. The SBT-QFE-3035 socket includes a contactor that is a stamped spring pin with 14-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 20.5 GHz and […]

A new high-performance elastomer socket for 1.27-mm-pitch QFN packages called the SG-MLF-7103 socket is designed for a 6.15×5.15-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]

New Grypper test sockets for eMMC and UFS BGA devices support the variety of sizes that 153 ball eMMC and UFS devices are produced, ranging from 7.5×7.5 mm to the 11.5×13.0 -0.50-pitch size. Ironwood Grypper socket, part number GR1135-XXXX, was designed for the new UFS 4.0 form factor of 153 BGA 11.0×13.0 – 0.50-pitch. To […]

A new stamped-spring pin socket addresses high-performance requirements for testing BGA256 packaged devices. Called the CBT-BGA-6122, the socket’s contactor is a stamped spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and […]

A new adapter for the three-pin TO-205AF packaged MOSFET device allows use of the equivalent product in an SOIC package to be used in PCBs developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip N-channel logic level MOSFET 2N6901. These adapters use an Ironwood-exclusive technology that allows a highly reliable and cost-effective […]

A new high-performance elastomer socket for 0.5-mm-pitch BGA packages, called the CG25-BGA-2002, is designed for a 6×6-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken with […]

A new socket addresses high-performance requirements for testing BGA289-packaged ICs.The contactor on the SBT-BGA-6577 socket is a stamped-spring pin with a 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. […]

A new high-performance QFP socket for 0.508-mm pitch 132-pin QFP packages called the SG-QFE-7025 socket is designed for a 19.39×19.39×4.22-mm package size with 24.79×24.79-mm lead tip-to-tip and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ per I/O. The socket connects all […]