New Grypper/G40 test sockets, part number 109111-0003, for the latest LPDDR5 memory devices allow testing of the newest generation of Package-On-Package type LPDDR5 devices that have 496 Ball 0.4-mm pitch, with speeds up to 5500 Mb/sec. The LPDDR5 Grypper/G40 socket fits to the same location/PCB footprint as the device allowing development and failure analysis. This […]
IC sockets
Open top socket for QFP48 packages
A new stamped-spring-pin socket addresses high-performance requirements for testing 48-lead Quad flat pack chip packages. The contactor used in the CBT-QFE-3018 socket is a stamped-spring pin with 17-gm actuation force/ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 31.7 GHz, and […]
ATE sockets handle QFN40 packages
A new QFN socket design uses high-performance elastomer capable of 60+ GHz and has a low inductance to handle ATE applications. The GTP-QFN-1001 socket is designed for a 5.9×5.9-mm package size and operates at bandwidths up to 60+ GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ/pin. The […]
75-GHz BGA socket handles Xilinx BGA1596 devices
A new BGA socket design uses high-performance elastomer capable of handling 75 GHz, low-inductance and wide temperature applications. The GT-BGA-2127 socket is designed for a 40×40-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The socket is designed to dissipate 150 W using a heat […]
DDR and other memory sockets target development, failure analysis chores
Technology Licensing and Operations agreements executed between Ironwood Electronics and HSIO Technologies now allow Ironwood to provide the Gypper DDR and other memory sockets. The DDR4 Ironwood Grypper socket, P/N 107022-0038, allows testing a device in the exact footprint as the device alone. Fitting the socket into the same location as on the end application […]
Spring-pin socket for optical engine chips
A new LGA socket, CBT-LGA-5019, addresses high-performance requirements for 1-mm pitch optical engine chips, self-contained electrical-to-optical transceiver units intended for computer interconnects. The contactor is a stamped-spring pin with 19-gm actuation force per pin and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss is less than 1 dB […]
Lever-actuated spring pin socket handles BGA ParallelCell (MCP) packages
A new BGA socket addresses high-performance requirements for Multi-Chip Packages – CBT-BGA-6093. The contactor is a stamped-spring pin with 31-gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz, and contact resistance is less than 30m&Ohm;. […]
40-GHz bandwidth socket for BGA190 packages
A new high-performance elastomer socket is designed to handle 0.5-mm-pitch BGA packages. The CG15-BGA-1003 socket is designed for a 10×5.7-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ per pin. Network analyzer reflection measurements for the […]
Lever-actuated spring pin socket for 200-W BGA3589 packages
A new BGA socket addresses high-performance requirements for MCUs. Caleed the CBT-BGA-6090, its contactor is a stamped spring pin with 19-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 14.1 to 21.9 GHz and contact resistance is
Lever-actuated spring pin socket for BGA676 packages
A new BGA socket called the CBT-BGA-6087 features a contactor in the form of a stamped spring pin with 19-gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 14.1 GHz, and contact resistance is