Altium, LLC, a leader in PCB design software, today announced the availability of Altium 365, the world’s first cloud platform for PCB design and realization. The platform is poised to transform the electronics industry by bridging the gap between PCB designers, part suppliers, and manufacturers through seamless collaboration as the design evolves. Altium 365 works […]
PCB design
Cloud-based PCB design software helps share layouts and models
Altium has launched a new cloud-based application that redefines the way that printed circuit board designs are shared between designers, part suppliers, and manufacturers. The A365 Viewer, powered by the Altium 365 cloud platform, is a brand new, and innovative way to view and share electronic designs through a browser on any web-enabled desktop, phone […]
E-commerce site offers designers device models on demand
MoDeCH Inc. launched its English language ecommerce site, “Model On! Search.” Previously available only in Japan, Model On! was developed over the past 15 years based on various proprietary modeling technologies for analog, high speed digital, and power electronics markets. “With Model On! Search, access to design and simulation models is now a one-stop shop […]
MIPI I3C v1.1 utility and control bus strengthens upgrade path implementations
The MIPI Alliance announced MIPI I3C v1.1, the first update to its innovative interface that eliminates the historical pain points of I2C development. MIPI I3C v1.1, available now to MIPI members, is a scalable, medium-speed, utility and control bus that connects peripherals to an application processor, streamlining integration and improving cost efficiencies in the development of smartphones, wearables, high-performance […]
Analog Top Talks in December 2019 on EDABoard.com
Peer-to-peer, engineer-to-engineer questions and answers from the EDABoard.com engineering community around analog ICs and analog design. Click the “Read more” link and follow the entire conversation and maybe add your two cents by logging in to EDAboard.com. Capacitor as a MOSFET in RC circuit – I have a resistor-capacitor circuit that I fitted with a […]
Enterprise software enables design and validation of PCB stackups
Z-zero announces the release of Z-planner Enterprise, a field-solver based stackup planning and material selection software that is optimized for front-to-back PCB design and signal-integrity flow. Z-planner Enterprise is an all-in-one solution that enables hardware design teams to design and validate PCB stackups. With interfaces to the most common PCB layout and signal-integrity design flows, […]
Shielding cans cut EMI on PCBs
Assisting engineers dealing with EMI/RFI issues in their PCB designs, Harwin has just announced the introduction of three new shielding cans. Supplied in a tape-and-reel format, these cans increase the company’s existing range of EMC products. The new can dimensions are 10mm x 10mm, 15mm x 10mm and 30mm x 10mm, all with a 3mm […]
Free PCB design software enhanced with new features
RS Components (RS) has released the latest version of its free DesignSpark PCB software for users in North America. DesignSpark PCB 9.0 is the latest version of the popular online design tool available to members of the DesignSpark online engineering community. New functionality now available in version 9.0 includes the ability to detect dangling connections, add copper pour to […]
Socket for 1mm pitch BGA socket operates at bandwidths up to 27 GHz
Ironwood Electronics has recently introduced a new high-performance BGA socket for 1mm pitch BGA 937 pin BGA. The CG-BGA-4028 socket is designed for 35X35mm package size and operates at bandwidths up to 27 GHz with less than 1dB of insertion loss. The socket is designed with easy-open clamshell lid mechanism that enhances the user experience […]
Solderable seals sport high elasticity for use with surface-mount components
With WE-SMGS, Würth Elektronik offers solderable seals for surface mounting. The WE-SMGS consists of a temperature-resistant foam material, which combines the conductive seals with high elasticity. After compression, they then return to their original shape. The layer surrounding the heat-resistant foam is made of copper weave with tinning. It facilitates the soldering process in the […]
