Parker Hannifin Corporation announced the launch of THERM-A-GAP PAD 30 and THERM-A-GAP PAD 60, the next generation of thermally conductive gap filler pads from Parker Chomerics. With the performance of 3.2 W/m-K thermal conductivity, THERM-A-GAP PAD 30 reliably conforms to rough surface irregularities and air gaps on heat-generating components. For higher performance applications, THERM-A-GAP PAD […]
Fillers
Thermal dielectric filler eliminates contamination in high-voltage applications
Henkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company’s line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel’s new material extends wider market opportunities and production flexibility to manufacturing operations […]
