Xilinx, Inc. (NASDAQ: XLNX) and TSMC (TWSE: 2330, NYSE: TSM) announced production release of the Virtex®-7 HT family, the industry’s first heterogeneous 3D ICs in production. With this milestone, all Xilinx 28nm 3D IC families are now in volume production. These 28nm devices were developed on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS™) 3D IC process that produces significant […]
Products
Toshiba Three-Phase Brushless Motor Driver IC
Toshiba America Electronic Components (TAEC), a committed leader that collaborates with technology companies to create breakthrough designs, today launches a highly integrated, sine-wave driver IC (Part Number TB6585AFTG) for implementation in three-phase DC brushless motors used in fan motors of home appliances. The device enables quiet operation, low vibration, and low-power consumption for ventilation and […]
Texas Instruments Names Winner of TI Analog Design Contest
Texas Instruments awarded Adam Munich, a freshman from Rochester Institute of Technology, as the overall winner of the Engibous Prize in its sixth annual TI Analog Design Contest. This contest showcases the innovative projects and competitive spirit of today’s future engineers. Munich’s project focused on improving the original Tesla coil, which is used to produce high-voltage, low-current […]
1-Wire Thermocouple-to-Digital Converters
The MAX31850/MAX31851, cold-junction-compensated, 1-Wire thermocouple-to-digital converters were introduced today. The devices achieve ±2.0°C accuracy (not including sensor nonlinearity) while integrating all of the functions required for a complete (thermocouple-to-digital solution). Additionally, the MAX31850/MAX31851’s 1-Wire interface allows multiple sensor locations to communicate and draw power over a single data line, greatly simplifying wiring requirements. Designers can […]
MEMS Wireless Vibration Sensing System
The wireless vibration sensing system allows industrial systems operators to remotely monitor production equipment health, improve system performance, and reduce maintenance costs. The new networked system includes the ADIS16229 iSensor wireless vibration sensor node, which combines dual-axis digital MEMs (micro-electro mechanical systems) acceleration sensing with advanced frequency-domain and time-domain signal processing. The sensing system […]
RF AND MICROWAVE INNOVATIONS AT IMS2013
The RF and microwave ICs are designed for high-performance transmitters and receivers that can be used in high-dynamic-range applications. Including wireless infrastructure, defense systems, industrial, microwave point-to-point radios and more. The new devices include: Incorporating high-performance broadband power detection technology, the ADL6010 microwave power detector offers unprecedented linearity and stability over temperature. Unlike alternative devices […]
