Digital threads and digital twins are used to create the virtual environments needed to implement model-based system engineering (MBSE), especially for complex cyber-physical systems. Digital threads are complete records of all details of specific aspects of product definition, development, and deployment, from conception through end of life. A digital twin is a comprehensive virtual representation […]
Simulation
What’s MBSE and what does it mean for designers?
Model-based system engineering (MBSE) uses digital twins, digital threads, and domain models to replace document-based information exchanges during the system development process. It is widely used with complex cyber-physical systems in aerospace, energy, healthcare, and transportation to define features, design, analyze and validate a system using virtual tools. For designers, MBSE is an expansive concept. […]
Schematic editor supports diplex matched antennas, antenna work flow
Remcom announces expanded capabilities within its schematic editor in the latest release of XFdtd 3D EM Simulation Software, including support for diplex matched antennas and new efficiencies aimed at streamlining antenna design workflows and shortening design cycles. XFdtd’s schematic editor is a novel electromagnetic simulation tool that combines matching network analysis with full-wave results, making it ideal […]
Simulation software includes schematic editor, frequency-domain circuit solver
Remcom announces the addition of a schematic editor and frequency-domain circuit solver in the latest release of XFdtd 3D EM Simulation Software, enabling today’s most advanced antenna matching network and corporate feed network analyses, including multi-state and multi-port devices. The new schematic editor is a sophisticated, integrated simulation tool that combines matching network analysis with full-wave […]
Design kit provides full coverage of flow to design and simulate analog and mixed-signal ICs
X-FAB Silicon Foundries SE has announced the release of a reference design kit for Tanner analog/mixed-signal (AMS) software from the EDA segment of Siemens Digital Industries Software. The new kit is based on silicon-proven circuitry, providing full coverage of the flow to design and simulate analog and mixed-signal ICs. More complex designs, shorter time-to-market pressures, […]
Unified, circuit simulation workflow incorporates fast SPICE engines to accelerate hyper-convergent designs
Today’s hyper-convergent SoCs consist of larger and faster-embedded memories, analog front-end devices, and complex I/O circuits that communicate at 100Gb+ data rates with the DRAM stack connected on the same piece of silicon in a system-in-package design. These challenges associated with verifying these complex designs scale as advanced technology process nodes present increased parasitics, process […]
Simulator helps select audio components for design goals
The team at PUI Audio has unveiled an intuitive new tool, putting the power to “Be Heard!,” directly in the hands of their customers. The PUI Audio Simulator was officially unveiled company-wide to the PUI sales team and manufacturing representative sales network on February 18 during the national sales kickoff, which took place virtually this year. The […]
Simulation too simplifies component selection, evaluation and verification for new designs
Texas Instruments announced a new custom version of the PSpice simulator from Cadence Design Systems Inc. that enables engineers to simulate complex analog circuits with unlimited analysis of TI power and signal-chain products. PSpice for TI offers full-featured circuit simulation with a growing library of more than 5,700 TI analog integrated circuit (IC) models, making […]
EDA FastSPICE, analog/mixed-signal platforms work with new process technologies
Mentor, a Siemens business, announced that its industry-leading Calibre nmPlatform and Analog FastSPICE (AFS) custom and analog/mixed-signal (AMS) circuit verification platform are now qualified for Samsung Foundry’s newest process technologies. Customers can now use these offerings on Samsung’s 5/4-nanometer FinFET processes for the verification and sign-off of production tapeouts for their most advanced IC designs. […]
Spice program upgrades help verify large, post-layout analog designs
Mentor, a Siemens business, announced significant advances in the Analog FastSPICE Platform with the introduction of Analog FastSPICE eXTreme technology for nanometer-scale verification of large, post-layout analog designs. Analog FastSPICE eXTreme includes revolutionary technology that can substantially boost simulation performance, while helping maintain the foundry-certified accuracy required for nanometer-scale analog verification. Analog FastSPICE eXTreme is especially […]
