Clamshell production test socket for BGA1062

A new Stamped spring pin socket addresses high-performance requirements for testing BGA1062 packages. Called the CBT-BGA-6077, it has a contactor that is a stamped spring pin with 31-gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and capacitance is 0.097pF. The current capacity of each contactor is 4 A at 40°C temperature rise. Socket temperature range is -55 to +180°C.

The socket features a clamshell lid design for ease of chip replacement in a production environment. It also has an integrated compression plate for vertical force actuation without distorting device position. The specific configuration of the package to be tested in the CBT-BGA-6077 is a BGA, 27×27 mm, 0.8-mm pitch 33×33 array with 1,062 balls. The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning.

To use, the operator places the BGA device into the socket and closes the lid by snapping to the latch. Vertical force is applied by turning the compression screw. The socket is made of aluminum components for power dissipation and it can be customized for higher power dissipation by adding an axial flow fan plus finned heat sink. This socket comes with thermal interface material to efficiently transfer heat from the silicon die to the outside ambient environment.

This socket can be used for quick device screening, device characterization at extreme temperatures as well as final production test.

Pricing for the CBT-BGA-6077 is $1,445 at qty 1 with reduced pricing available depending on quantity required.

Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 952-229-8200 or (800) 404-0204