• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer

Analog IC Tips

Analog IC Design, Products, Tools Layout

  • Products
    • Amplifiers
    • Clocks & Timing
    • Data Converters
    • EMI/RFI
    • Interface & Isolation
    • MEMS & Sensors
  • Applications
    • Audio
    • Automotive/Transportation
    • Industrial
    • IoT
    • Medical
    • Telecommunications
    • Wireless
  • Learn
    • eBooks / Tech Tips
    • FAQs
    • EE Learning Center
    • EE Training Days
    • Tech Toolboxes
    • Webinars & Digital Events
  • Resources
    • Design Guide Library
    • Digital Issues
    • Engineering Diversity & Inclusion
    • LEAP Awards
    • Podcasts
    • White Papers
    • DesignFast
  • Video
    • EE Videos
    • Teardown Videos
  • EE Forums
    • EDABoard.com
    • Electro-Tech-Online.com
  • Engineering Training Days
  • Advertise
  • Subscribe

Electronic design platform connects cloud resources to PCB workflows

November 13, 2024 By Redding Traiger

Siemens Digital Industries Software has announced the latest advancement in its electronic systems design portfolio. The new release integrates Xpedition software, Hyperlynx software, and PADS Professional software into a unified user experience with cloud connectivity and AI capabilities to advance innovation in electronic systems design.
The electronic systems design industry faces challenges including engineering talent shortages, supply chain uncertainties, and increasing design complexity. These factors have affected engineers and the development ecosystem’s ability to meet modern electronics development demands. Siemens’ next-generation solution addresses these challenges through an intuitive, AI-enhanced, cloud-connected, integrated, and secure platform.
The release combines Xpedition, Hyperlynx, and PADS Professional software through a unified experience that emphasizes ease-of-use and unification. This enables engineers to work more efficiently and achieve faster results. The modern user interface shared across all Xpedition and HyperLynx products increases productivity and makes HyperLynx analysis accessible to more designers.
The solution includes predictive engineering and support assistance using AI to enhance engineers’ capabilities and optimize workflows. Cloud connectivity facilitates collaboration across the value chain and provides access to specialized services and resources. This allows engineers to adapt to changing requirements, gain supply chain insights, and collaborate with stakeholders regardless of location.
The software features enhanced integration with Siemens’ Teamcenter software for product lifecycle management and NX software for product engineering. This enables multi-BOM support and closer collaboration between ECAD and MCAD domains. Security measures include configurable data access restrictions with geo-location capabilities, adherence to industry protocols, and partnerships with cloud providers. The platform also supports design and verification requirements management for model-based systems engineering.
Siemens’ next-generation electronic systems design solution, including Xpedition NG software and HyperLynx NG software, is currently available. PADS Pro NG software will be released in the second quarter of 2025.

You may also like:


  • What is an analog front end (AFE) in a battery…

  • What are the elements of analog IC EDA tools?

  • What are the computational requirements of immersive audio?

  • How does artificial intelligence relate to immersive audio?
  • Transponders in satellite communication systems
    What’s the difference between transceivers and transponders?

Filed Under: Artificial Intelligence, Connectivity, PCB design, Products, Software, Tools Tagged With: siemensdigitalindustries

Primary Sidebar

Featured Contributions

Design a circuit for ultra-low power sensor applications

Active baluns bridge the microwave and digital worlds

Managing design complexity and global collaboration with IP-centric design

PCB design best practices for ECAD/MCAD collaboration

Open RAN networks pass the time

More Featured Contributions

EE TECH TOOLBOX

“ee
Tech Toolbox: 5G Technology
This Tech Toolbox covers the basics of 5G technology plus a story about how engineers designed and built a prototype DSL router mostly from old cellphone parts. Download this first 5G/wired/wireless communications Tech Toolbox to learn more!

EE LEARNING CENTER

EE Learning Center
“analog
EXPAND YOUR KNOWLEDGE AND STAY CONNECTED
Get the latest info on technologies, tools and strategies for EE professionals.

EE ENGINEERING TRAINING DAYS

engineering

RSS Current EDABoard.com discussions

  • Diode recovery test Irrm timing.
  • How to make string LEDs?
  • The Analog Gods Hate Me
  • Battery Deep Discharge – IC Workarounds?
  • Safe Current and Power Density Limits in PCB Copper(in A/m² and W/m³) simulation

RSS Current Electro-Tech-Online.com Discussions

  • Raise your hand if your car had one of these:
  • Tektronix 2235 channel 1 trace unstable
  • How to make string LEDs?
  • Wideband matching an electrically short bowtie antenna; 50 ohm, 434 MHz
  • The Analog Gods Hate Me
“bills

Design Fast

Component Selection Made Simple.

Try it Today
design fast globle

Footer

Analog IC Tips

EE WORLD ONLINE NETWORK

  • 5G Technology World
  • EE World Online
  • Engineers Garage
  • Battery Power Tips
  • Connector Tips
  • DesignFast
  • EDA Board Forums
  • Electro Tech Online Forums
  • EV Engineering
  • Microcontroller Tips
  • Power Electronic Tips
  • Sensor Tips
  • Test and Measurement Tips

ANALOG IC TIPS

  • Subscribe to our newsletter
  • Advertise with us
  • Contact us
  • About us

Copyright © 2025 · WTWH Media LLC and its licensors. All rights reserved.
The material on this site may not be reproduced, distributed, transmitted, cached or otherwise used, except with the prior written permission of WTWH Media.

Privacy Policy