A new high-performance BGA socket handles 0.8-mm-pitch, 1764 pin BGA ICs. The SG-BGA-6503 socket is designed for ICs in 35×35-mm packages and operates at bandwidths up to 27 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ/pin. The socket connects all pins with 27 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering and uses the industry’s smallest footprint. The socket is constructed with a swivel-lid for easy chip replacement. The socket comes with ball guide for the precise alignment of BGA balls to PCB pads. To use, the operator places the device inside the socket, places the floating compression plate on top of the device, closes the lid via swivel motion and applies compression by torqueing a 50-W heat-sink screw-plus-fan with a mounted bracket.
The SG-BGA-6503 socket is constructed with a high-performance and low-inductance elastomer contactor. The temperature range is -35 to +125°C. The pin self-inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance-to-ground is 0.01 pF. Current capacity is 2 A/pin. The socket works with devices such as a 1764BGA, 35×35-mm package with 42×42 array and 0.8-mm pitch.
Pricing for the SG-BGA-6503 is $1,037 at qty 1 with reduced pricing available depending on quantity required.
Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 952-229-8200 or (800) 404-0204, www.ironwoodelectronics.com.