Rogers Corporation introduces the RO4460G2, a low-loss bondply with a 6.15 dielectric constant (Dk). RO4000® thermoset high performance bonding layers have long been used by circuit designers for multilayer board constructions using Rogers high frequency and high speed digital materials where operating frequency, dielectric constant, or high-speed signal requirements dictate the need for high performance materials. The introduction of RO4460G2 bondply now provides designers a 0.004” (0.101 mm) bonding layer that complements the already released RO4360G2™ low loss, glass-reinforced 6.15 Dk copper clad thermoset laminates.

RO4460G2 bondply exhibits excellent Dk control for repeatable electrical performance, a low z axis expansion for plated through hole reliability, and thermoset bond temperatures compatible with standard epoxy/glass (FR-4) processes. RO4460G2 bondply is an excellent choice for multilayer designs requiring sequential laminations, as fully cured RO4400™ bondplies are capable of withstanding multiple lamination cycles. Each of the RO4400 bondplies have the UL V-0 flame retardant rating, and are compatible with lead-free processes.