Ironwood Electronics has introduced a new near-device-footprint surface-mount (SMT) elastomer socket designed for BGA264 packages. The socket supports mixed-pitch configurations of 0.6 × 0.675 millimeters and a device size of 8.7 × 14.4 millimeters, providing a compact layout with high electrical performance.
The design enables the socket to be reflow-mounted onto the same printed circuit board location as the device it replaces for testing, allowing engineers to evaluate components without altering the overall board footprint. The socket uses GT elastomer contact technology, providing high signal integrity with bandwidth performance reaching approximately 43 GHz at –1 dB insertion loss on a 0.5 millimeter pitch BGA. It is suitable for applications requiring a wide operating temperature range, from –55 °C to +160 °C, and has been validated for reliability across multiple insertion cycles.
Engineered for surface-mount compatibility, the socket eliminates the need for mounting holes and is well suited for board designs where space is limited. This configuration allows quick replacement of BGA264 devices during development and validation, simplifying the testing process while maintaining consistency between test and production environments.
The new elastomer socket offers a combination of compact form, electrical precision, and durability aimed at accelerating device characterization and system-level evaluation for high-performance integrated circuits.
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