The Mentor OSAT (Outsourced Assembly And Test) Alliance Program is being launched by Mentor, a Siemens company, to help drive ecosystem capabilities in support of new High-Density Advanced Packaging (HDAP) technologies like 2.5D IC, 3D IC and Fan-Out Wafer-Level Packaging (FOWLP) for customer IC designs. In launching the Alliance, Mentor says it will work with OSATs to provide fabless companies with design kits, certified tools, and best practices to aid in the smoother adoption of these new packaging solutions that require a much tighter link between chip and package design. Mentor also announced that Amkor Technology is its first OSAT Alliance Program member.
Through the Mentor OSAT Alliance, members work with Mentor to create certified design kits to help customers speed up IC and advanced package development with Mentor’s Tanner L-Edit AMS design cockpit, Calibre IC physical verification platform, HyperLynx SI/PI and HyperLynx full-wave 3D tools, Xpedition Package Integrator and Xpedition Package Designer tools, and Mentor’s newly announced Xpedition HDAP flow.
Members of the Mentor OSAT Alliance will receive software, training and reference flow best practices from Mentor, in addition to the opportunity for co-marketing mutual offerings.
“The next generation of IC packaging will require increased heterogeneous die integration incorporating reduced size, weight, and improved performance and reliability,” said Ron Huemoeller, corporate vice president, Research and Development, at Amkor. “Amkor’s Silicon Wafer Integrated Fan-out Technology (SWIFT) package technology is designed to provide increased I/O and circuit density within a significantly reduced footprint and profile for single and multi-die applications. Being an integral part of the Mentor OSAT Alliance will allow us to fast-track PDK development and delivery, and enable our customers to design more efficiently and predictably.”