Nexperia announced the world’s smallest and lowest profile 14,16, 20, and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the new package also offers a 25% saving in the PCB area.
Measuring just 2 mm x 2 mm (14 pins), 2 mm x 2.4 mm (16 pins), 2 mm x 3.2 mm (20 pins), and 2 mm x 4 mm (24 pins), the 0.4 mm pitch DHXQFN packages are only 0.45 mm high. The parts include hex inverting Schmitt-triggers; 8-bit SIPO shift registers with output latches; 4-bit dual supply translating transceivers; octal buffer/line drivers; octal bus transceivers; and 8-bit dual supply translating transceivers.
Furthermore, the small footprint of the DHXQFN package enables devices to be placed closer to the bypass capacitor. This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high-frequency applications since the traces between logic device and capacitor are shorter.