The 0.8 mm pitch BGA socket adapter from Ironwood Electronics provides an interposer solution for prototyping, testing and programming chip-scale BGA devices with ultra-fine footprints. The adapter supports a 19 × 19 mm body with a 22 × 22 array 484-ball BGA package and can be surface-mounted to a top adapter or used in a compression-mount socket, while the bottom adapter attaches to the target PCB via reflow. Designed for repeated plug and unplug cycles, the top and bottom adapters maintain contact reliability and signal integrity, including in rugged automotive and high-density test environments.
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