Socket handles 0.8-mm-pitch interstitial array, 609BGA packages

A new BGA socket design uses high-performance elastomer capable of 75 GHz while providing a low inductance and handling wide temperature ranges. The GT-BGA-2027 socket from Ironwood Electronics is designed for a 21×21-mm package and adds less than 1 dB of insertion loss. The socket is designed to dissipate few watts using aluminum components and can be customized up to 100 W by adding a central heat sink and axial flow fan. The contact resistance is typically 30 milliohms per pin. The socket mounts on the target PCB with no soldering and uses only a small amount of real estate allowing capacitors/resistors to sit close by.

Other passive components can be placed on the back side of PCB by creating custom cutouts in the stiffener plate. The socket is constructed with a cam-actuated lever lid with central opening for direct thermal characterization of silicon. To use, technicians place the device inside the socket, then close the clamshell lid by latching and apply downward pressure by turning the lever. The lever provides mechanical advantage in applying 67 lb. easily.

The GT-BGA-2027 socket is constructed with high performance and low-inductance elastomer contactor. The temperature range is -55 to +160°C. It works with ICs such as 609 BGA, 21×21 mm with 35×35 interstitial array and 0.8-mm pitch.

Pricing for the GT-BGA-2027 is $1,066 at quantity one; reduced pricing available depending on quantity required.