A new high-performance BGA socket for 0.61 x 0.635-mm pitch BGA 378-pin ICs called the SG-BGA-7303 operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. 
The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 W with a custom heat sink. The contact resistance is typically 20 milliohms/pin. The socket connects all pins with 30 GHz bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB with no soldering and uses smallest footprint in the industry. The small footprint allows inductors, resistors and decoupling capacitors to sit close to the device for impedance tuning. The socket also incorporates a simple hardware installation method so ICs can be changed out quickly.
The SG-BGA-7303 sockets are constructed with a high-performance and low-inductance elastomer contactor. The temperature range is -35 C to +100°C. The pin self-inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 A/pin. Elastomer requires proper force for operation which is applied through a torque-limiting driver via compression screw. Typical ICs that can be tested using this socket have 378 balls, 18.2 x 9.7 mm with 0.61 x 0.635-mm pitch and 27×14 ball array.
Pricing for the Ironwood Electronics SG-BGA-7303 is $890 at qty 1; with reduced pricing available depending on quantity required.
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