A new adapter for the three-pin TO-205AF packaged MOSFET device allows use of the equivalent product in an SOIC package to be used in PCBs developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip N-channel logic level MOSFET 2N6901. These adapters use an Ironwood-exclusive technology that allows a highly reliable and cost-effective […]
ironwoodelectronics
40-GHz-bandwidth sockets handle BGA121 chip packages
A new high-performance elastomer socket for 0.5-mm-pitch BGA packages, called the CG25-BGA-2002, is designed for a 6×6-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken with […]
Stamped-spring pin sockets handle BGA289 chip packages
A new socket addresses high-performance requirements for testing BGA289-packaged ICs.The contactor on the SBT-BGA-6577 socket is a stamped-spring pin with a 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097 pF. […]
Elastomer sockets handle high-bandwidth 0.508-mm pitch 132QFP packages
A new high-performance QFP socket for 0.508-mm pitch 132-pin QFP packages called the SG-QFE-7025 socket is designed for a 19.39×19.39×4.22-mm package size with 24.79×24.79-mm lead tip-to-tip and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ per I/O. The socket connects all […]
94-GHz BGA sockets handle Xilinx FFVB676 packages
A new BGA socket design uses high-performance elastomer capable of 94 GHz and features a low inductance for use in applications characterized by wide temperature ranges. The GT-BGA-2175 socket is designed for a 27×27-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is […]
Sockets handle BGA472 packages, perform like direct solder connections
A new BGA socket design uses high-performance elastomer capable of 94 GHz, features low inductance and handles wide temperature applications. The GT-BGA-2164 socket is designed for a 23×23-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The socket is designed with a screw-down lid and […]
High-temperature spring-pin sockets handle LGA464 packages
A new LGA socket addresses high-performance requirements for 1.5-mm-pitch LGA464 packages. The CBT-LGA-5037 socket’s contactor is a stamped-spring pin with 19-gm actuation force/pin and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss is < 1 dB at 23 GHz, and capacitance is 0.097 pF. The current capacity of […]
IC sockets handle smaller-footprint BGA-154b packages
New socket technology addresses newer smaller footprint devices released in the Open NAND Flash Interface (ONFi) 5.0 specification. The Grypper socket is surface-mounted using standard soldering methods to the same location on the PCB. The Grypper requires no lid; the device simply snaps into the socket. Because the Grypper contacts are only 1.5 to 2.2-mm […]
Socket for LGA1156 packages handles extreme temperatures, provides superior electrical performance
A new LGA socket addresses high-performance requirements for 1-mm-pitch LGA1156 devices. The CBT-LGA-5036 contains a contactor that is a stamped spring pin with 19-gm actuation force per pin and features a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss is less than 1 dB at 23 GHz, and […]
Sockets for LGA255 packages handle 94 GHz frequencies
A new LGA socket design uses a high-performance elastomer capable of 94 GHz and sports a low inductance for test applications. The GTP-LGA-1003 socket is designed for a 17×17-mm package size, 16×16 array, 1-mm-pitch and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The contact resistance is typically […]
