A new high-performance BGA socket for 0.65-mm pitch BGA 625 pin devices called the CG-BGA-5032 is designed for the 16×16-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an easy-open double latch clamshell lid with an integrated compression mechanism. The […]

New Grypper/G40 test sockets, part number 109111-0003, for the latest LPDDR5 memory devices allow testing of the newest generation of Package-On-Package type LPDDR5 devices that have 496 Ball 0.4-mm pitch, with speeds up to 5500 Mb/sec. The LPDDR5 Grypper/G40 socket fits to the same location/PCB footprint as the device allowing development and failure analysis. This […]

A new stamped-spring-pin socket addresses high-performance requirements for testing 48-lead Quad flat pack chip packages. The contactor used in the CBT-QFE-3018 socket is a stamped-spring pin with 17-gm actuation force/ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 31.7 GHz, and […]

A new QFN socket design uses high-performance elastomer capable of 60+ GHz and has a low inductance to handle ATE applications. The GTP-QFN-1001 socket is designed for a 5.9×5.9-mm package size and operates at bandwidths up to 60+ GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ/pin. The […]

Technology Licensing and Operations agreements executed between Ironwood Electronics and HSIO Technologies now allow Ironwood to provide the Gypper DDR and other memory sockets. The DDR4 Ironwood Grypper socket, P/N 107022-0038, allows testing a device in the exact footprint as the device alone. Fitting the socket into the same location as on the end application […]

A new LGA socket, CBT-LGA-5019, addresses high-performance requirements for 1-mm pitch optical engine chips, self-contained electrical-to-optical transceiver units intended for computer interconnects. The contactor is a stamped-spring pin with 19-gm actuation force per pin and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss is less than 1 dB […]

A new BGA socket addresses high-performance requirements for Multi-Chip Packages – CBT-BGA-6093. The contactor is a stamped-spring pin with 31-gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz, and contact resistance is less than 30m&Ohm;. […]

A new high-performance elastomer socket is designed to handle 0.5-mm-pitch BGA packages. The CG15-BGA-1003 socket is designed for a 10×5.7-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ per pin. Network analyzer reflection measurements for the […]