Ironwood Electronics introduces stamped spring pin socket addressing high performance requirements for testing BGA35 – CBT-BGA-7525. The contactor is a stamped spring pin with 8 gram actuation force per ball and cycle life of 75,000 insertions. The self-inductance of the contactor is 0.92 nH, insertion loss < 1 dB at 24.7 GHz, and capacitance 0.058pF. The current […]
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Chip-size socket boasts -1dB insertion loss
Ironwood Electronics’ chip-size socket connects LPDDR5 to the system PCB with minimal signal loss. The supported device size is 14x14mm, 21×21 array, 0.65mm pitch BGA 441. Once the socket is soldered down to PCB, the device can be simply plugged into it. This Grypper socket has excellent electrical performance of – 1dB insertion loss greater […]
Elastomer socket for BGA324 packages with 23-W power dissipation
A new socket handles ASE package BGA 324 devices. The sockets use an elastomer technology as a contactor between the IC package and the circuit board. The elastomer can support +50 GHz bandwidth and comes with a protective cover. (The cover is necessary because the elastomers are sensitive to dirt.) The elastomer has a low […]
Elastomer sockets handle BGA1365 chip packages
New sockets handle ball grid array devices with a 1,365 pin count and a 0.65-mm pitch. The socket utilizes a high-performance elastomer contactor and has over 40 GHz bandwidth with a -1 dB insertion loss. The self-inductance is 0.21 nH. Capacitance to ground is 0.15 pF. Current capacity is 4 A/pin. The socket operates over […]
Stamped-spring pin socket accepts dual-row QFP packages
A new socket addresses high performance requirements for burn-in and test applications. The SBT-QFE-3035 socket includes a contactor that is a stamped spring pin with 14-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 20.5 GHz and […]
Chip sockets handle flat no-lead SO-8 packages
A new high-performance elastomer socket for 1.27-mm-pitch QFN packages called the SG-MLF-7103 socket is designed for a 6.15×5.15-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
Sockets handle UFS and eMMC chip packages
New Grypper test sockets for eMMC and UFS BGA devices support the variety of sizes that 153 ball eMMC and UFS devices are produced, ranging from 7.5×7.5 mm to the 11.5×13.0 -0.50-pitch size. Ironwood Grypper socket, part number GR1135-XXXX, was designed for the new UFS 4.0 form factor of 153 BGA 11.0×13.0 – 0.50-pitch. To […]
Lever-actuated open-top spring pin socket for BGA256 packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA256 packaged devices. Called the CBT-BGA-6122, the socket’s contactor is a stamped spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss less than 1 dB at 15.7 GHz and […]
Package converter technology allows use of SMT devices on through-hole PCBs
A new adapter for the three-pin TO-205AF packaged MOSFET device allows use of the equivalent product in an SOIC package to be used in PCBs developed for TO packages. The PC-SOT23-TO39-01 is mapped specifically for the Microchip N-channel logic level MOSFET 2N6901. These adapters use an Ironwood-exclusive technology that allows a highly reliable and cost-effective […]
40-GHz-bandwidth sockets handle BGA121 chip packages
A new high-performance elastomer socket for 0.5-mm-pitch BGA packages, called the CG25-BGA-2002, is designed for a 6×6-mm package size and operates at bandwidths up to 40 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken with […]
