A new high-performance low-profile elastomer socket handles 0.5-mm-pitch QFN packages. The SG25-QFN-2017 socket is designed for a 4×4-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]

A new high-performance elastomer socket for 0.8-mm-pitch BGA package called the SG25-BGA-2067 socket is designed for an 8×8-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ per pin. Network analyzer reflection measurements for the G-S-S-G case […]

A new socket addresses high-performance requirements for burn-in and test applications. The SBT-BGA-6048 has a contactor that is a stamped spring pin with a 19-gm actuation force per ball and has a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, the insertion loss is < 1 dB at 14.1 GHz, […]

A new socket addresses high-performance requirements for burn-in and test applications of flip chip lidded ball grid arrays. The SBT-BGA-6562 device incorporates a contactor that is a stamped-spring pin with 30-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.95 nH, insertion loss of < 1 dB […]

New innovative SMT Grypper sockets from Ironwood include NAND, Controller, and Buffer sockets used in Solid State Drives, Cards and Modules. The Zero Foot Print (Grypper) sockets are available for the NAND and Open NAND Flash Interface (ONFi) Standard and also sockets for the new 3D XPoint devices. The socket is surface-mounted using standard soldering […]

New Grypper Y test sockets handle industry-standard eMMC/Universal Flash Storage (UFS) memory devices. The Ironwood Grypper socket, part number 113036-0003, allows testing of the newest generation (UFS) 153 BGA form-factor and all the eMMC devices as well. The socket will fit the 11.5×13-mm device size and will also allow smaller device sizes with the use […]

A new high-performance BGA socket for 0.65-mm pitch BGA 625 pin devices called the CG-BGA-5032 is designed for the 16×16-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an easy-open double latch clamshell lid with an integrated compression mechanism. The […]

New Grypper/G40 test sockets, part number 109111-0003, for the latest LPDDR5 memory devices allow testing of the newest generation of Package-On-Package type LPDDR5 devices that have 496 Ball 0.4-mm pitch, with speeds up to 5500 Mb/sec. The LPDDR5 Grypper/G40 socket fits to the same location/PCB footprint as the device allowing development and failure analysis. This […]

A new stamped-spring-pin socket addresses high-performance requirements for testing 48-lead Quad flat pack chip packages. The contactor used in the CBT-QFE-3018 socket is a stamped-spring pin with 17-gm actuation force/ball and a cycle life of 10,000+ insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 31.7 GHz, and […]

A new QFN socket design uses high-performance elastomer capable of 60+ GHz and has a low inductance to handle ATE applications. The GTP-QFN-1001 socket is designed for a 5.9×5.9-mm package size and operates at bandwidths up to 60+ GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ/pin. The […]