A new high-performance QFN socket handles 0.15-mm-pitch devices. The SS-QFN184A-01 socket, designed for a 9.2×6-mm package size, operates at bandwidths up to 23.8 GHz with less than 1 dB of insertion loss. Designed for up to 500,000 actuation cycles, the socket is able to dissipate up to 2 W over a temperature range of –40 […]
ironwoodelectronics
WLCSP packages get 52-GHz-bandwidth sockets
A new high-performance elastomer socket is designed to handle 0.35-mm-pitch WLCSP packages. The SG25-BGA-2071 socket is designed for a 4.525×4.525-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case […]
High-temperature sockets handle new LGA297 packages
A new LGA socket addresses high performance requirements for 0.5-mm pitch LGA297–CBT-LGA-5029 packages. The contactor has a stamped-spring pin with a 31-gm actuation force/pin and a cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance is 0.097pF. The […]
LGA56 sockets perform as well as direct-solder versions
A new LGA socket design uses a high-performance elastomer capable of 94 GHz and providing low inductance for ATE applications. The GTP-LGA-1002 socket is designed for a 10×10-mm package size and operates at bandwidths up to 94 GHz with less than 1 dB of insertion loss. The contact resistance is typically 30 mΩ/pin. The socket […]
Sockets handle 35×35-mm, 0.8-mm pitch BGA1764 packages with no performance loss
A new high-performance BGA socket handles 0.8-mm-pitch, 1764 pin BGA ICs. The SG-BGA-6503 socket is designed for ICs in 35×35-mm packages and operates at bandwidths up to 27 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ/pin. The socket connects all pins with 27 GHz bandwidth on all […]
New test sockets handle LPDDR5 memory chips
The 297 BGA socket is one of many newer LPDDR4X and LPDDR5 Grypper test sockets. This socket uses the Grypper contacting technology that allows the test socket to be placed in the exact location as the device. The Grypper socket has the same footprint as the device and requires no lid to hold the device […]
Lever-actuated open-top spring-pin socket handles BGA780 packages
A new stamped-spring pin socket addressing high performance requirements for testing BGA780 packages is called the CBT-BGA-7054. The contactor is a stamped-spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
Clamshell production test socket handles ASE’s 361 LFBGA packages
A new stamped-spring pin socket addresses high-performance requirements for testing BGA361 – CBT-BGA-7056 packages. The contactor is a stamped-spring pin with 31 gm actuation force per ball and a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance 0.097 […]
Removable-lid spring-pin socket handles QFN28 packages
A new QFN socket addresses high performance requirements for custom size devices. Called the CBT-QFN-7071, the socket contactor is a stamped-spring pin with 14.5-gm actuation force per pin and a cycle life of 100,000 insertions. The self-inductance of the contactor is 0.98 nH, insertion loss is below 1 dB at 31.7 GHz, and the capacitance […]
Sockets enable fast swap-out of BGA devices for development sorting, failure analysis
Grypper sockets for BGA components used on Memory cards are great for enabling fast swap-out of BGA devices for development sorting and failure analysis. The Grypper socket allows operators to simply snap-in the BGA device – No Lid needed. The Grypper sockets are the same size as the device, so they will reflow directly onto […]
