Grypper sockets for BGA components used on Memory cards are great for enabling fast swap-out of BGA devices for development sorting and failure analysis. The Grypper socket allows operators to simply snap-in the BGA device – No Lid needed. The Grypper sockets are the same size as the device, so they will reflow directly onto […]
ironwoodelectronics
Chip sockets provide 75-GHz bandwidth for 0.25-mm-pitch devices
A new 0.25-pitch socket uses a high-performance elastomer capable of 75 GHz with low inductance and capable of working in a wide temperature range. The 1280 WLCSP socket is designed for a 10×8-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The contact resistance is […]
Extreme temperature sockets facilitate testing 216-lead quad flat pack devices
A new Stamped spring pin socket addresses high-performance requirements for testing 216-lead Quad flat packs – CBT-QFE-3021. The contactor used in the CBT-QFE-3021 socket is a stamped-spring pin with 14-g actuation force per lead and cycle life of 125,000+ insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB […]
52-GHz-bandwidth sockets handle Kyocera optical QFN packages
A new high-performance low-profile elastomer socket handles 0.5-mm-pitch QFN packages. The SG25-QFN-2017 socket is designed for a 4×4-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ/pin. Network analyzer reflection measurements for the G-S-S-G case were taken […]
52-GHz bandwidth socket handles Maxim’s CTBGA package
A new high-performance elastomer socket for 0.8-mm-pitch BGA package called the SG25-BGA-2067 socket is designed for an 8×8-mm package size and operates at bandwidths up to 52 GHz with less than 1 dB of insertion loss (GSSG configuration). The contact resistance is typically 20 mΩ per pin. Network analyzer reflection measurements for the G-S-S-G case […]
Spring-pin sockets for 1-mm-pitch BGA and LGA packages
A new socket addresses high-performance requirements for burn-in and test applications. The SBT-BGA-6048 has a contactor that is a stamped spring pin with a 19-gm actuation force per ball and has a cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, the insertion loss is < 1 dB at 14.1 GHz, […]
Stamped-spring pin sockets handle 0.8-mm-pitch Amkor FCLBGA packages
A new socket addresses high-performance requirements for burn-in and test applications of flip chip lidded ball grid arrays. The SBT-BGA-6562 device incorporates a contactor that is a stamped-spring pin with 30-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.95 nH, insertion loss of < 1 dB […]
Zero-foot-print test sockets handle SSD NAND and 3D XPoint chips
New innovative SMT Grypper sockets from Ironwood include NAND, Controller, and Buffer sockets used in Solid State Drives, Cards and Modules. The Zero Foot Print (Grypper) sockets are available for the NAND and Open NAND Flash Interface (ONFi) Standard and also sockets for the new 3D XPoint devices. The socket is surface-mounted using standard soldering […]
Test sockets handle eMMC, Universal Flash Storage devices
New Grypper Y test sockets handle industry-standard eMMC/Universal Flash Storage (UFS) memory devices. The Ironwood Grypper socket, part number 113036-0003, allows testing of the newest generation (UFS) 153 BGA form-factor and all the eMMC devices as well. The socket will fit the 11.5×13-mm device size and will also allow smaller device sizes with the use […]
Socket handles 625-pin BGA625 package without significant performance loss
A new high-performance BGA socket for 0.65-mm pitch BGA 625 pin devices called the CG-BGA-5032 is designed for the 16×16-mm package size and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an easy-open double latch clamshell lid with an integrated compression mechanism. The […]