By Aijaz Fatima of Siemens business Functional verification is the process of demonstrating the functional correctness of a design with respect to the design specifications. Functional verification does not confirm the correctness of the design specification and assumes that the design specification is correct. It is one of the most challenging steps of the IC […]
mentor
EDA FastSPICE, analog/mixed-signal platforms work with new process technologies
Mentor, a Siemens business, announced that its industry-leading Calibre nmPlatform and Analog FastSPICE (AFS) custom and analog/mixed-signal (AMS) circuit verification platform are now qualified for Samsung Foundry’s newest process technologies. Customers can now use these offerings on Samsung’s 5/4-nanometer FinFET processes for the verification and sign-off of production tapeouts for their most advanced IC designs. […]
Spice program upgrades help verify large, post-layout analog designs
Mentor, a Siemens business, announced significant advances in the Analog FastSPICE Platform with the introduction of Analog FastSPICE eXTreme technology for nanometer-scale verification of large, post-layout analog designs. Analog FastSPICE eXTreme includes revolutionary technology that can substantially boost simulation performance, while helping maintain the foundry-certified accuracy required for nanometer-scale analog verification. Analog FastSPICE eXTreme is especially […]
End-to-end automation is the next leap forward for DFT
by Jay Jahangiri, Product Manager for Mentor, a Siemens Business, Tessent product family The increase in IC design size and complexity adds a number of new challenges to the design flow, including design-for-test (DFT). One of the most successful changes in design-for-test (DFT) flows in recent years has been the deployment of hierarchical DFT. For […]
OSAT alliance program aims to streamline IC high-density advanced packaging design and manufacturing
The Mentor OSAT (Outsourced Assembly And Test) Alliance Program is being launched by Mentor, a Siemens company, to help drive ecosystem capabilities in support of new High-Density Advanced Packaging (HDAP) technologies like 2.5D IC, 3D IC and Fan-Out Wafer-Level Packaging (FOWLP) for customer IC designs. In launching the Alliance, Mentor says it will work with […]
Software addresses high-density advanced chip and board packaging flow
New software addresses the steps involved in advanced IC package design from rapid prototyping to GDS signoff. Developed by Mentor, a Siemens business, the Xpedition High-Density Advanced Packaging (HDAP) flow combines the Mentor Xpedition, HyperLynx, and Calibre technologies. The new Mentor IC package design flow is said to deliver faster, higher-quality results compared to existing […]
PCB production Plan tool powered by SAP NetWeaver streamlines PCB assembly planning
Mentor Graphics announced that its Valor Production Plan software has been certified by SAP as powered by the SAP NetWeaver technology platform. The integration of the Valor Production Plan tool with SAP NetWeaver streamlines printed circuit board (PCB) assembly planning, such as surface mount technology, manual assembly and test, helping to improve manufacturing efficiency and reduce […]
CAD package handles IC, package, and PCB design
A new software package enables what is called the co-design of ICs, packages, and the printed circuit boards on which they reside. Called the Xpedition Package Integrator, the software is said to facilitate the planning, assembly and optimization of today’s complex multi-die packages. It incorporates a special virtual die model concept for optimizing IC-to-package connections. […]
