BGA socket adapter handles 256-pin, 1-mm pitch Xilinx FPGAs

A new high-performance BGA Socket Adapter called the LS-BGA256E-15 allows users to convert a compression-mount BGA socket which needs mounting holes (in the target PCB) into a version for conventional through-hole soldering options. The adapter consists of machined-brass pins pressed into an FR4 wafer. The top side of the adapter has gold-plated pads to receive socket interconnects and the bottom side has 0.008-in.-diameter pin tails. The adapter can be soldered to any thru-hole pattern using conventional soldering methods or plugged into mating female receptacle.

The companion female receptacle is attached directly to the target PCB using the same soldering methods as attaching a BGA. The target BGA device is inserted into a compression-mount socket which is mechanically connected to the LS-BGA256E-15 using mounting screws. The two parts are interconnected together with gold-plated machined pins for highest reliability. The BGA socket adapter configuration allows mounting BGA sockets to the zero-keep-out BGA footprint.

Pricing for the LS-BGA256E-15 adapter $187 each at quantity one.

Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 952-229-8200 or (800) 404-0204, www.ironwoodelectronics.com