Electronics are getting more compact, yet also more powerful, especially with the rise of 5G. Components packed into tight spaces produce complex signal interference issues, which can hinder device operability in automotive and other industries. But using standard EMI-mitigating absorbers as an interface between a radiating component and housing can put too much stress on […]
UHF modules handle narrow-band Tx/Rx tasks
Saelig Company, Inc. has announced the compact, multi-channel CDP-07M UHF Narrow-Band Transmitter/Receiver Pair: CDP-TX-07M (transmitter) and CDP-RX-07M (receiver). The modules contain almost all of the components necessary for radio transmission in a compact housing. The newly released CDP-TX-07M and CDP-RX-07M inherit the compact, high-functionality, high-quality concept of their first-generation models, and function as 434MHz 10mW ISM band radio modules, […]
PCIe 5.0 clock generators and buffers offer forward compatibility for telecom applications
Diodes Incorporated announced the company’s first families of clock generators and clock buffers that meet PCIe 5.0 specifications while still complying with PCIe 4.0 and previous generations. This gives product developers the forward compatibility they require when developing server, storage, and networking equipment for datacenters that today use PCIe 4.0 but must be ready for […]
MEMS pressure sensors feature fast response, high resolution, long-term stability
Bourns, Inc. announced the addition of four new model families to the Bourns Precision Sensor (BPS) line. Based on state-of-the-art Micro-Electro-Mechanical Systems (MEMS) technology, the four new BPS310, BPS320, BPS330 and BPS340 series are cost-effective pressure sensor solutions that feature ultra-fast response times, high resolution, and long-term stability. These features, along with the ability to work with pressure ranges from 5 […]
Oven controlled voltage controlled SAW oscillators reach 1.2 GHz
IQD Frequency Products has launched a range of high-frequency Oven Controlled Voltage Controlled SAW Oscillators (OCVCSOs). Three frequencies are currently available in the OCVCSO series, 400MHz, 800MHz and 1.2GHz and they are packaged in a 25.4 x 22 x 13.2mm industry standard SMD package. These OCVCSOs have a noise floor of 10dB to 15dB lower […]
Flip-type MLCCs target automotive apps
TDK has developed the new CGAE series, the world’s first flip-type MLCCs in 0510 design (EIA 0204) with capacitances of up to 1 µF, for automotive applications. Depending on their capacitance, the capacitors are designed for rated voltages of between 4 V and 50 V and they cover a capacitance range from 47 nF to […]
Pulse Density Modulation microphone features super-wide dynamic range
TDK announces the T5818 Pulse Density Modulation (PDM) microphone with a dynamic range of 107dB at 590µA, the widest dynamic range in the industry at the lowest power. This allows for excellent acoustic performance in environments that shift from very quiet to very loud, such as far-field voice pickup barge-in for Smart Speaker applications. The T5818 microphone features 66dBA SNR, 135dB […]
Analog Top Talks in December 2019 on EDABoard.com
Peer-to-peer, engineer-to-engineer questions and answers from the EDABoard.com engineering community around analog ICs and analog design. Click the “Read more” link and follow the entire conversation and maybe add your two cents by logging in to EDAboard.com. Capacitor as a MOSFET in RC circuit – I have a resistor-capacitor circuit that I fitted with a […]
Shielding cans cut EMI on PCBs
Assisting engineers dealing with EMI/RFI issues in their PCB designs, Harwin has just announced the introduction of three new shielding cans. Supplied in a tape-and-reel format, these cans increase the company’s existing range of EMC products. The new can dimensions are 10mm x 10mm, 15mm x 10mm and 30mm x 10mm, all with a 3mm […]
Speaker line simplifies design integration from prototype to production
CUI Devices’ HYPERLINK Audio Group today announced the introduction of a new line of enclosed speakers designed to maximize performance and simplify design integration from prototype to production. Available in rectangular or round frame shapes with profiles as low as 4.87 mm, the HYPERLINK CES series carries sound pressure levels (SPLs) from 89 to 104 […]
- 1
- 2
- 3
- …
- 44
- Next Page »
