Relays are humble devices, but they are not immune to being impacted by the Internet of Things. Electromechanical relays, solid-state relays, and MEMs relays are among the numerous devices in the IoT that can connect to the cloud. Some relays include Wi-Fi controllers or Bluetooth, some use power over Ethernet (PoE), and others use voice […]
IoT
Wideband, log periodic, directional antennas handle bandwidths of 600 to 6,000 MHz
Fairview Microwave has expanded its line of wideband, log periodic antennas that operate from 600 to 6,000 MHz for point-to-point wireless communications. Fairview’s new, outdoor-rated, directional antennas function as boosters where the existing cellular signal is weak and needs to reach longer distances. This makes them ideal for strengthening 5G, 4G, LTE, CMDA, LoRA, IoT, and Wi-Fi signals. […]
Multilayer chip antenna covers 700-960 MHz, 1,710-2,690 MHz ranges
Würth Elektronik is now launching an additional multilayer chip antenna for the miniaturization of radio applications. Measuring just 40 x 6 x 5 mm, the WE-MCA antenna (7488918022) covers the 700 to 960 MHz and 1710 to 2690 MHz frequency ranges. With its hitherto unachieved form factor and slender profile, the antenna offers an excellent size-to-performance ratio. […]
The future of PCBs in the world driven by IoT
By Suresh Patel, Sales Engineer, Mer-Mar Electronics One of the mega tech trends revolutionizing today’s digital world is the ubiquitous Internet of Things (IoT). The significant factors pushing the IoT market are the decreased cost of CPU memory and storage, abundant availability of sensor devices, and accessibility of expandable repositories for storing data (like cloud […]
Notch filters boast built-in ESD protection function
TDK Corporation announces the release of its newly developed AVRF041A150MT242 and AVRF061D2R4ST532 notch filters with ESD protection function. Volume production of these devices will begin in March 2022. The new notch filters are compliant with the IEC61000-4-2 Level 4 immunity standard. They are well suited to ensuring EMC requirements are met in the audio circuits […]
Economical sub-miniature tactile switch supports one-million cycles
C&K has extended its tactile switch product family to include a long-life sub-miniature version. The PTS526 Series sub-miniature tactile switch expands upon the popular PTS526 switch series, with a 100% increase in electrical life cycle from 500,000 to 1,000,000 actuations. The PTS526 Series addresses the growing need for high quality and competitively priced switch solutions […]
Dual-band WiFi antennas optimized for 2.4GHz and 5GHz applications
AVX Corporation released a new series of IP67-rated, external, dual-band Wi-Fi antennas optimized for 2.4GHz and 5GHz applications. The new X9001748 Series external, dual-band Wi-Fi antennas have a standardized, ready-to-use, RoHS-compliant design with IP67 sealing for reliable outdoor operation and provide high-gain, high-efficiency, and high-reliability performance in low- and high-band applications with a variety of device configurations and […]
PCB design software features enhanced design rules, via handling
Number One Systems announced the release of Easy-PC version 25, with over 25 new technology features based on user requests from professional PCB designers. Easy-PC has been created by a team of engineering professionals who have rewritten the rule book for EDA tools to provide the optimal design experience. Easy-PC is packed with time-saving features […]
MEMs microphones feature high SNR, wide dynamic range
TDK Corporation introduces three new MEMS microphones as part of the SmartSound family of products for mobile, IoT, and other consumer devices. Each of these high-performance microphones pushes the boundaries of microphone acoustic performance, providing advanced feature sets with very low power in small package footprints. The SmartSound family of MEMS microphones from TDK are […]
Unified, circuit simulation workflow incorporates fast SPICE engines to accelerate hyper-convergent designs
Today’s hyper-convergent SoCs consist of larger and faster-embedded memories, analog front-end devices, and complex I/O circuits that communicate at 100Gb+ data rates with the DRAM stack connected on the same piece of silicon in a system-in-package design. These challenges associated with verifying these complex designs scale as advanced technology process nodes present increased parasitics, process […]
