Electronics are getting more compact, yet also more powerful, especially with the rise of 5G. Components packed into tight spaces produce complex signal interference issues, which can hinder device operability in automotive and other industries. But using standard EMI-mitigating absorbers as an interface between a radiating component and housing can put too much stress on […]
MEMS pressure sensors feature fast response, high resolution, long-term stability
Bourns, Inc. announced the addition of four new model families to the Bourns Precision Sensor (BPS) line. Based on state-of-the-art Micro-Electro-Mechanical Systems (MEMS) technology, the four new BPS310, BPS320, BPS330 and BPS340 series are cost-effective pressure sensor solutions that feature ultra-fast response times, high resolution, and long-term stability. These features, along with the ability to work with pressure ranges from 5 […]
Flip-type MLCCs target automotive apps
TDK has developed the new CGAE series, the world’s first flip-type MLCCs in 0510 design (EIA 0204) with capacitances of up to 1 µF, for automotive applications. Depending on their capacitance, the capacitors are designed for rated voltages of between 4 V and 50 V and they cover a capacitance range from 47 nF to […]
Localization chip integrates triple-band RTK/GNSS receiver and triple-redundant inertial sensor
Acienna announced the availability of the new ACEINNA OpenRTK330L, a low cost, state-of-the-art, high-performance triple-band RTK/GNSS receiver with built-in triple-redundant inertial sensors. Designed to replace the expensive and bulky precision RTK/INS systems used in today’s autonomous systems, this compact navigation solution meets the challenging performance, reliability and cost requirements of the automotive market along with […]
Speaker line simplifies design integration from prototype to production
CUI Devices’ HYPERLINK Audio Group today announced the introduction of a new line of enclosed speakers designed to maximize performance and simplify design integration from prototype to production. Available in rectangular or round frame shapes with profiles as low as 4.87 mm, the HYPERLINK CES series carries sound pressure levels (SPLs) from 89 to 104 […]
RF PIN diodes now available from California Eastern Laboratories
California Eastern Laboratories (CEL) and LITEC Corporation announce a partnership allowing CEL to exclusively promote and sell LITEC’s RF PIN diode products in the Americas, Israel and India. CEL has a 60+ year history of marketing RF components to those territories. LITEC PIN diodes have been designed into most of the commercial radio systems in […]
Voice ADC excels at far-field audio
Texas Instruments introduced a new audio analog-to-digital converter (ADC) capable of capturing clear audio up to four times farther away than competing devices. The TLV320ADC5140 is the industry’s smallest quad-channel audio ADC with this level of performance. The device is part of a new family of three TI Burr-Brown audio ADCs that enable low-distortion audio […]
Power dividers, directional couplers handle 40 GHz
Cinch Connectivity Solutions, a Bel group company, launches 40GHz power dividers and directional couplers designed to meet the higher frequency requirements in telecommunications and 5G applications. The Midwest Microwave 40 GHz power dividers and directional couplers are small, lightweight, and ruggedly built. They cover a wide bandwidth of 6 to 40 GHz with low insertion loss and low […]
RF downconverter platform extends the life of existing RF test equipment to meet 5G requirements
ThinkRF Corp. announced the new ThinkRF D4000 RF Downconverter. The platform is the industry’s first 40 GHz downconverter, allowing engineers to quickly and reliably analyze the new 5G wireless standard by extending the range of their existing RF test equipment. To leverage the performance, latency, and capacity that 5G promises, you need equipment which can […]
What are the functions and principles of S-parameters (Part 1)?
As design frequencies now routinely go into the hundreds of MHz and tens of GHz range, conventional voltage and current measurements are not useful, but scattering (s) parameters can fully characterize the RF component or path performance. For engineers with experience focused from DC to several hundred megahertz, it is usually sufficient to characterize components […]
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