International Manufacturing Services, Inc. (IMS) is now producing Temperature Variable Attenuators (TVAs) for a wide range of applications to 20 GHz and beyond. Its new AV-0607-C TVAs are ideal for RF power amplifiers (PAs), broadcast equipment, and multiband communications systems. With their low-noise, thin-film construction, the TVAs exhibit decreasing attenuation with increasing temperature to help […]
Applications
Understanding ADC specs and architectures: part 1
Analog-to-digital converters are the heart of most test equipment, setting the stage for the digital processing of analog signals. Several posts over the past year or so have involved digital signal processing. For example, we have covered the fast Fourier transform (FFT), the inverse FFT, and discrete convolution. To perform these operations on real-world signals, […]
Amplifier delivers 0.15% gain accuracy with 2.1 MHz bandwidth
STMicroelectronics’ TSC1801 low-side current-measurement amplifier integrates matched resistors to set the gain, which simplifies the circuit design, saves bill-of-materials costs, and ensures gain accuracy within 0.15% over the entire temperature range. The fixed gain also eliminates production trimming of external resistors. Combining very high accuracy and wide bandwidth, the TSC1801 is used for motor control, […]
Design a circuit for ultra-low power sensor applications
Sensors monitoring mechanical and biological systems must often scavenge power from the thing being sensed. The oscillator circuits shown here let you operate those sensors. Sensor circuits that connect to thermocouples, electromagnetic mechanical-to-electrical transducers, and piezoelectric mechanical-to-electrical transducers often use oscillators powered through energy harvesting from solar cells and other sources. These power sources can […]
9 mm square module achieves -100 dBm receive sensitivity
Insight SIP is launching the ISP2554-HM module. This module represents a dynamic IOT node, with support for Bluetooth Low Energy, Thread, and Zigbee radios and high-performance computing including an ability to run AI at the Edge. It can thus form the core of a complex IOT device with an unparalleled mixture of features, performance, and […]
Infrared preamps improve sensitivity and better reject interference
Vishay Intertechnology, Inc. announced that it has upgraded its VSOP383xx series of preamplifier circuits for infrared (IR) remote control applications in consumer products with the new Cyllene 2 IC. Offered in the 2 mm by 2 mm by 0.76 mm QFN package, the enhanced solutions provide drop-in, plug-and-play replacements for existing devices in the series […]
Multi-die verification platform reduces compile time
Synopsys (has expanded its hardware-assisted verification (HAV) portfolio with new HAPS prototyping and ZeBu emulation systems based on the AMD Versal Premium VP1902 adaptive SoC. The HAPS-200 prototyping and ZeBu-200 emulation systems provide improved runtime performance, compile time, and debug productivity through their EP-Ready Hardware platform, which enables reconfiguration between emulation and prototyping use cases. […]
Elastomer socket combines thermal and RF power
To verify the performance of a high-power network processor chip, Ironwood Electronics’ 94+ GHz bandwidth elastomer socket can be used with a heatsink/axial flow fan to remove 135+ watts of heat generation. The elastomer socket is transparent, so the performance is equivalent to that of the direct solder version. The inductance of elastomer is 0.1nH, and […]
How AI and ML optimize functional verification for EDA
Functional verification ensures that the register transfer layer (RTL) implementation of semiconductor designs operates according to specified requirements. Electronic engineers typically perform functional verification using hardware verification languages (HVLs) such as SystemVerilog paired with the universal verification methodology (UVM). Other HVLs, such as VHSIC Hardware Description Language (VHDL) and Property Specification Language (PSL), may be […]
EE Training Days kicks-off 2025 with The A to Z of Multi-die Design
Did you know that multi-die architectures now represent over 50% of new semiconductor designs, marking a significant shift in chip development strategy? It’s true. There’s now a clear trend towards more multi-die designs, especially in data center, AI, and server applications where the complexity of the chips is too large to fit on a single […]
