KEMET announces its new R53 series of miniature, polypropylene film X2 EMI (electromagnetic interference) suppression capacitors. This series fulfills the growing need for automotive, industrial, consumer, and energy applications that require a smaller, high-capacitance X2 class solution for suppressing EMI. The R53 series offers capacitance values from 0.1µF to 22µF, lead-spacing from 15mm to 37.5mmm, […]
Automotive
Thermal dielectric filler eliminates contamination in high-voltage applications
Henkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company’s line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel’s new material extends wider market opportunities and production flexibility to manufacturing operations […]
Automotive-grade polymer chip caps exhibit low DCL, benign failure mode
AVX Corporation released the new TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX’s field-proven TCQ Series automotive […]
Phased-array antennas optimized for satellites, space vehicles
ThinKom Solutions announced the development of a new family of phased-array antennas for deployment on satellites and other space vehicles. The antennas are based on ThinKom’s proven VICTS (Variable Inclination Continuous Transverse Stub) technology. The multi-frequency full-duplex antennas are designed for operation on geostationary and non-geostationary satellites using C-, X-, Ku-, Ka-, Q-, V-, E- and […]
Rail-to-rail input/output high-speed CMOS op amps target automotive, industrial apps
ROHM Semiconductor announced the BD8758xY series (BD87581YG-C, BD87582YFVM-C) of rail-to-rail input/output high-speed CMOS op-amps. The devices feature improved EMI immunity for automotive and industrial equipment applications requiring high-speed sensing in harsh environments, such as vehicle engine control units and anomaly detection systems for factory automation equipment. In recent years, advancements in electrification and mounting density have […]
4-channel, ESD device for high-speed interfaces protects automotive and video link applications
Nexperia has announced a new range of ESD protection devices aimed specifically at protecting the ever-increasing number of high-speed interfaces found in automotive applications, especially the in-vehicle networks (IVN) associated with infotainment and vehicle communications. As data rates increase and vehicles feature more electric content, the need for EMC protection becomes more critical, and providing […]
Thick-film chip resistor arrays comply with AEC-Q200 standard
Bourns, Inc. announced several new AEC-Q200 compliant thick film chip resistor array model families. Bourns designed the new surface-mount model CATxxA-LF, CAYxxA-LF, and CAYxxA-AS series to help increase available board space and reduce costs. Offering long-life protection against many sulfurous environments, the Model CAYxxA-AS series is the first chip arrays from Bourns that meet both the AEC-Q200 […]
Interference suppression caps operate to 125 °C
TDK Corporation presents a new series of EPCOS MKP-X2 capacitors for interference suppression. In contrast to conventional models, which are designed for a maximum operating temperature of 110 °C, the new capacitors offer a maximum permissible operating temperature of 125 °C. The capacitance range of the B3292*P series ranges from 0.033 µF to 5.6 µF, […]
HIgh-frequency, high-bandwidth RFICs and MMICs target RF and microwave
CML Microcircuits has announced the SµRF, a new range of high frequency, high bandwidth RFICS and MMICs targeting RF and mmWave applications. As wireless communications move further into the GHz range, the need for high-quality RF building blocks to enable high bandwidth and low latency is growing rapidly. The global demand for faster downloads and […]
A comparison of EMI test setups and specifications for automotive, industrial and defense applications, part 1: conducted emissions
by Timothy Hegarty, Applications Engineer, Texas Instruments This article compares electromagnetic interference (EMI) requirements in automotive, industrial, and defense product family standards, specifically various test parameters, test equipment, test setups, and test methods [1-4] for conducted emissions (CEs). The comparison includes widely used dedicated standards in each industry: Comité International Spécial des Perturbations Radioélectriques (CISPR) […]
