Passive intermodulation (PIM) is a pernicious and destructive phenomenon for cellular network operators. PIM shows up as a set of unwanted signals created by mixing two or more strong RF signals. Mixing generally produces the sum and difference frequencies of the two transmit signals F1 and F2. These signals are F1 + F2 and F1 […]
Telecommunications
VSWR and impedance, Part 6: Microstrip and stripline
Understanding the role and implications of impedance in RF transmission lines and antennas is vital to successful system performance. The traditional matching approaches are still in wide use, but new application requirements and advances in components, modeling and simulation, and manufacturing precision have also provided new ways to address the matching problem. Q: What is […]
VSWR and impedance, Part 4: Measurements
Understanding the role and implications of impedance in RF transmission lines and antennas is vital to successful system performance. The previous section looked at the basics of VSWR. This section looks at two approaches to measuring impedance and VSWR. Q: What do engineers and users need to know? A: For some applications, such as connecting […]
VSWR and impedance, Part 2: Reflected power
Understanding the role and implications of impedance in RF transmission lines and antennas is vital to successful system performance. Part 1 of this article looked at the basics of impedance matching and power transfer. This part looks at the closely related topic of nominal impedance and VSWR. Q: Why all this worry? Aren’t RF systems […]
Dev kit works with ADC for mixed-signal, subsystem implementations
Teledyne e2v has expanded the scope of engineering support accompanying its popular EV12AQ60x analog-to-digital converter (ADC) series. The new EV12AQ600-FMC-EVM development kit will be an invaluable tool for those implementing mixed-signal subsystems. Intended for prototyping work relating to avionics, military, space, telecommunications, industrial, and high energy physics applications, this kit may be used for evaluating […]
Understanding Radio Frequency communications
Wireless communication has been around since the 18th century when James Clerk Maxwell first proposed that electromagnetic waves can be generated and can travel through free space. Heinrich Rudolf Hertz conducted the experiments in which he demonstrated the generation, transmission, and reception of electromagnetic waves, which became the basis of Radio Frequency communication. Wireless communication […]
4-channel, ESD device for high-speed interfaces protects automotive and video link applications
Nexperia has announced a new range of ESD protection devices aimed specifically at protecting the ever-increasing number of high-speed interfaces found in automotive applications, especially the in-vehicle networks (IVN) associated with infotainment and vehicle communications. As data rates increase and vehicles feature more electric content, the need for EMC protection becomes more critical, and providing […]
Thick-film chip resistor arrays comply with AEC-Q200 standard
Bourns, Inc. announced several new AEC-Q200 compliant thick film chip resistor array model families. Bourns designed the new surface-mount model CATxxA-LF, CAYxxA-LF, and CAYxxA-AS series to help increase available board space and reduce costs. Offering long-life protection against many sulfurous environments, the Model CAYxxA-AS series is the first chip arrays from Bourns that meet both the AEC-Q200 […]
Front-haul ICs drive 50 Gbps PAM4 5G wireless optical modules
Semtech Corporation announced sampling of the newest member of its Tri-Edge CDR portfolio, the GN2256. Integrating Semtech’s proven Tri-Edge CDR platform with a differential EML (Externally Modulated Laser) driver, the GN2256 is the industry’s first such IC solution to enable 50Gbps PAM4 Fixed-WDM (Wavelength Division Multiplexing), Tunable WDM and Silicon Photonics optical modules. As with all […]
Automotive conductive polymer chip capacitors span 10–470 μF, 2.5–50 V
AVX Corporation has both expanded and improved upon its AEC-Q200-qualified TCQ Series Automotive Conductive Polymer Chip Capacitors, which have been field-proven in a wide range of demanding automotive, industrial, and telecommunications applications with limited board space and challenging operating environments since 2015. The series now offers two new case sizes for a total of five, several […]
