A new high-performance QFP socket for 0.508-mm pitch 132-pin QFP packages called the SG-QFE-7025 socket is designed for a 19.39×19.39×4.22-mm package size with 24.79×24.79-mm lead tip-to-tip and operates at bandwidths up to 30 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 mΩ per I/O. The socket connects all pins with 30 GHz-bandwidth on all connections. The socket is mounted using supplied hardware on the target PCB 
with no soldering and uses smallest footprint in the industry. The small footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. The socket also incorporates a swivel lid with a compression screw so ICs can be changed-out quickly. The socket features a floating compression plate made out of Ultem1000 material to force down the QFP leads on to the elastomer. There is also a hard stop feature built into the compression mechanism.
The SG-QFE-7025 sockets are constructed with high-performance and low-inductance gold-plated embedded wire-on-elastomer as interconnect material between the device and PCB. The temperature range is -35 to +125°C. The pin self-inductance is 0.15 nH and mutual inductance is 0.025 nH. Capacitance-to-ground is 0.01 pF. Current capacity is 2 A/pin.
Pricing for the SG-QFE-7025 is $800 at qty 1; with reduced pricing available depending on quantity required.
Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 952-229-8200 or (800) 404-0204, Fax: 952-229-8201, info@ironwoodelectronics.com, www.ironwoodelectronics.com
