A new socket addresses high-performance requirements for burn-in and test applications of flip chip lidded ball grid arrays. The SBT-BGA-6562 device incorporates a contactor that is a stamped-spring pin with 30-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.95 nH, insertion loss of < 1 dB at 18.1 GHz and a capacitance of 0.284 pF. The current capacity of each contactor is 3 A (free air). Socket temperature range is -55 to +180°C. The socket features a floating guide for precise ball-to-pin alignment. The socket also features a 30-W heat sink screw for power dissipation. The specific configuration of the package to be tested in the SBT-BGA-6562 is a BGA, 21×21-mm body size, 0.8-mm pitch and 25×25 ball array. To use, the operator drops the IC into the socket, places the compression plate and swivels the lid. Down force is applied by turning a heat sink compression screw with axial fan. This socket can be used for hand-test and quick turn custom burn-in applications with the most stringent requirements.
Pricing for the SBT-BGA-6562 is $1,844 at qty 1 with reduced pricing available depending on quantity required.
Ironwood Electronics, 1335 Eagandale Ct., Eagan, MN 55121, 952-229-8200 or (800) 404-0204, info@ironwoodelectronics.com,
www.ironwoodelectronics.com