C&K Components, a leading global manufacturer of electromechanical switches, smart card interconnect devices, and high reliability connectors, has expanded its KSC Series sealed SMT tact switches with the addition of four ultra long life switches that deliver up to five million cycles. Featuring momentary action functionality, single-pole, single-throw (SPST) contact arrangement, the IP67-rated KSC Series […]
Miniature polymer tantalum caps sport low ESR
AVX Corporation, has earned a third superlative for its F38 Series miniature, undertab, conductive polymer tantalum capacitors by significantly reducing the ESR of several ratings. The F38 Series, which already offered the smallest and highest CV polymer tantalum capacitors in the industry — 0603 capacitors with an ultralow profile of 0.9mm and 6.3V/47μF ratings — […]
New high reliability VCOs cover frequencies from 10 MHz to 11 GHz in a variety of packages
Pasternack, a provider of RF, microwave and millimeter wave products, has just added an all new product line of voltage controlled oscillators covering select bands from 10 MHz to 11 GHz in a variety of package options. This line of voltage controlled oscillators is most commonly deployed in applications such as phase locked loops, frequency […]
Multilayer 0402 inductors feature world’s highest Q in a small package
TDK Corporation announces the new MHQ0402PSA series of multilayer inductors in case size IEC 0402. Measuring in with reduced dimensions of just 0.4 mm x 0.2 mm x 0.2 mm, the new inductors feature a Q factor of 21 at 1 GHz, the highest value for any multilayer inductor of its size*, making them suitable […]
Antenna & RF design center for M2M and IoT opens in San Diego
In the midst of explosive wireless device growth in the Internet of Things market, innovative antenna leader Taoglas USA, Inc. has announced it has opened a unique facility for its North American customers in San Diego. Quadrupling the original size of its local facility — it’s now more than 16,000 square feet — the Taoglas […]
MMSM PIN diode for high-power RF switching
Microsemi Corporation (Nasdaq: MSCC) has announced a new high power monolithic microwave surface mount (MMSM) series-shunt SP2T PIN diode reflective switch, the MPS2R10-606. The device is optimized for high frequency (HF),very high frequency (VHF) and ultrahigh frequency (UHF) high power transmit/receive (T/R) switching in applications such as magnetic resonance imaging (MRI) receive arrays and first […]
X-band silicona quad-core IC supports radar and 5G-phased arrays
Richardson Electronics, Ltd. (NASDAQ: RELL) announced today the availability of a new X-band silicon quad-core integrated circuit from Anokiwave, Inc. The highly-integrated AWS-0101 is intended for radar and 5G phased array applications. The device supports four radiating elements, single-beam transmit and dual-beam receive, and includes all requisite beam-steering controls for 6-bit phase and gain control. […]
Richardson Electronics Introduces X-Band Silicon Quad-Core IC from Anokiwave
Richardson Electronics, Ltd. has announced the availability of a new X-band silicon quad-core integrated circuit from Anokiwave, Inc. The highly-integrated AWS-0101 is intended for radar and 5G phased array applications. The device supports four radiating elements, single-beam transmit and dual-beam receive, and includes all requisite beam-steering controls for 6-bit phase and gain control. It provides […]
Off-line flyback switching ICs optimize charging performance of smart mobile devices
Power Integrations has announced its InnoSwitch-CP family of off-line CV/CC flyback switching ICs. The new devices incorporate a constant power output profile which, when paired with an adaptive-voltage protocol such as Qualcomm Quick Charge 3.0 or USB-PD, permits smart mobile device makers to optimize charging time across a range of products. Developers employing adaptive charging […]
4-ball WLCSP EEPROM with multiple I2C addresses
STMicroelectronics has extended its M24 serial EEPROM family with four new devices that are fully compatible with the industry-standard 4-ball WLCSP (Wafer Level Chip Scale Package) footprint. The new additions also enable, for the first time, to connect two or more 4-pin EEPROMs to the same I2C bus with an individual I2C address hard-wired internally. […]
