TDK Corporation has expanded its CN series of multilayer ceramic capacitors (MLCCs) that are the first of their kind. The new products, 10 μF capacitance in 3216 size (3.2 x 1.6 x 1.6 mm) and 22 μF capacitance in 3225 size (3.2 x 2.5 x 2.5 mm), offer low-resistance soft termination with low terminal resistance […]
tdkcorporation
MEMs microphones feature high SNR, wide dynamic range
TDK Corporation introduces three new MEMS microphones as part of the SmartSound family of products for mobile, IoT, and other consumer devices. Each of these high-performance microphones pushes the boundaries of microphone acoustic performance, providing advanced feature sets with very low power in small package footprints. The SmartSound family of MEMS microphones from TDK are […]
Interference suppression caps operate to 125 °C
TDK Corporation presents a new series of EPCOS MKP-X2 capacitors for interference suppression. In contrast to conventional models, which are designed for a maximum operating temperature of 110 °C, the new capacitors offer a maximum permissible operating temperature of 125 °C. The capacitance range of the B3292*P series ranges from 0.033 µF to 5.6 µF, […]
Multilayer chip NTC thermistors mount via conductive adhesion
TDK Corporation announces the development of new chip NTC thermistors designed for conductive adhesion mounting, expanding TDK’s NTCSP series product lineup. The chip NTC thermistors are used for temperature sensing and compensation, measuring without direct contact in automotive applications including ABS, inside the transmission or engine, and more. The new NTCSP series part numbers are […]
Automotive noise suppression filters work in MF and HF bands
TDK Corporation announces that it has developed the MHF1608 series of HF band noise suppression filters for automobiles, and will begin mass production in September 2020. The noise suppression component will be inserted in signal lines for electronic control circuits in automotive applications including car audio, navigation, and battery monitoring systems. Signal transmission paths are […]
MEMS analog microphone sport high dynamic range, low power consumption
TDK introduces the InvenSense ICS-40638 MEMS analog microphone. The ICS-40638 microphone offers an ultra-high Acoustic Overload Point (AOP) of 138 dB Sound Pressure Level (SPL), exceptionally efficient 170 µA low power operation and high Signal to Noise Ratio (SNR) of 63 dB in a small 3.5 mm x 2.65 mm x 0.98 mm bottom port […]
Flip-type MLCCs target automotive apps
TDK has developed the new CGAE series, the world’s first flip-type MLCCs in 0510 design (EIA 0204) with capacitances of up to 1 µF, for automotive applications. Depending on their capacitance, the capacitors are designed for rated voltages of between 4 V and 50 V and they cover a capacitance range from 47 nF to […]
Pulse Density Modulation microphone features super-wide dynamic range
TDK announces the T5818 Pulse Density Modulation (PDM) microphone with a dynamic range of 107dB at 590µA, the widest dynamic range in the industry at the lowest power. This allows for excellent acoustic performance in environments that shift from very quiet to very loud, such as far-field voice pickup barge-in for Smart Speaker applications. The T5818 microphone features 66dBA SNR, 135dB […]
Ultra-thin piezo speakers handle high SPL, large frequency range
TDK has expanded its lineup of ultra-thin PiezoListen speakers with new types featuring a wider dynamic range and higher sound pressure level (SPL) in the low-frequency range, even at voltages up to 24 VP-P. The PiezoListen series of piezo speakers now includes the PHUA6630 wide dynamic range speaker with an operating frequency range of 400 […]
EMI suppression capacitors rated at 350 Vac
TDK is now offering a new series of EPCOS MKP Y2 capacitors for EMI suppression. In contrast to conventional types that are designed for rated voltages of 300 V AC, these new capacitors offer a permissible rated voltage of 350 V AC. The capacitances of the B3203* series range from 4.7 nF to 1.2 µF. Even under harsh environmental conditions, the […]
