RS Components (RS) has released the latest version of its free DesignSpark PCB software for users in North America. DesignSpark PCB 9.0 is the latest version of the popular online design tool available to members of the DesignSpark online engineering community. New functionality now available in version 9.0 includes the ability to detect dangling connections, add copper pour to […]
Upgraded PCB design software now handles blind/buried vias, complex spacing rules
In conjunction with the official launch of its DesignSpark online engineering and design community in North America, RS Components (RS) is debuting DesignSpark PCB Pro, a professional-level upgrade to its already popular free online PCB design tool, DesignSpark PCB. DesignSpark PCB is a free-to-use electronic computer-assisted design (ECAD) rapid prototyping tool offering workflow integration; unlimited […]
Simulation software models electrostatic discharge tests
Remcom announces the ability to simulate electrostatic discharge (ESD) testing in the latest release of XFdtd 3D EM Simulation Software, enabling engineers to identify potential locations of dielectric breakdown and components at risk of damage in their device designs. For less obvious damage this pre-prototype insight is especially valuable, as it enables optimized ESD mitigation […]
Simulation software handles high-frequency electromagnetics
Siemens Digital Industries Software announces today the latest version of Simcenter 3D software, with major enhancements for low- and high-frequency electromagnetic solutions to help accelerate electromagnetics simulation processes. The latest version advances simulation capabilities with increased multidisciplinary integration capabilities, faster CAE process, increased openness and scalability, and enhanced capabilities to integrate with the digital thread. […]
New software facilitates multi-discipline
collaboration for multi-board systems
New design software aims to enable a seamless concurrent collaboration among multi-discipline teams working on multi-board designs. Called Xpedition, the software was developed by Mentor Graphics Corp. It is said to eliminate redundant effort during the design process and to optimize product performance and reliability with a data management infrastructure. The result is better data […]
PCB Product Creation Platform gets Advanced Analog/Mixed-Signal, High-Speed Analysis features targeting design Engineers
Mentor Graphics Corp. has made additions to its PADS PCB Product Creation Platform designed to address engineering challenges associated with mixed-signal design, DDR implementation, and electrically-correct design signoff. The additions consist of a new PADS AMS Design Suite, PADS AMS Cloud, PADS HyperLynx DRC, and PADS HyperLynx DDR modules. Combined with the recently announced PADS […]
Wireless EM propagation software gets better with 64-bit GUI
Remcom announced an updated version of Wireless InSite, its site-specific radio propagation software for the analysis of wireless communication systems. This update, Release 2.8.1, includes performance enhancements such as XStream GPU Acceleration support for NVIDIA Maxwell architecture-based GPUs for the X3D model and a 64-bit graphical user interface (GUI). This release updates Wireless InSite’s X3D […]
PADS PCB design software targets independent engineers
New software that aids in the design of printed circuit boards (PCBs) is said to be optimized for independent engineers, those typically part of a small to mid-sized company, or members of an isolated team within a large enterprise. Called the PADS family of PCB design software by its creator, Mentor Graphics Corp., the software […]
CAD package handles IC, package, and PCB design
A new software package enables what is called the co-design of ICs, packages, and the printed circuit boards on which they reside. Called the Xpedition Package Integrator, the software is said to facilitate the planning, assembly and optimization of today’s complex multi-die packages. It incorporates a special virtual die model concept for optimizing IC-to-package connections. […]
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