Rogers Corporation is pleased to introduce SpeedWave 300P Ultra-Low Loss Prepreg. With the increasing need for stackup flexibility in high layer count designs for 5G mmWave, high resolution 77 GHz automotive radar, aerospace & defense and high speed digital designs, SpeedWave 300P prepreg offers a broad range of competitively priced high performance options for the […]
EDA FastSPICE, analog/mixed-signal platforms work with new process technologies
Mentor, a Siemens business, announced that its industry-leading Calibre nmPlatform and Analog FastSPICE (AFS) custom and analog/mixed-signal (AMS) circuit verification platform are now qualified for Samsung Foundry’s newest process technologies. Customers can now use these offerings on Samsung’s 5/4-nanometer FinFET processes for the verification and sign-off of production tapeouts for their most advanced IC designs. […]
Spice program upgrades help verify large, post-layout analog designs
Mentor, a Siemens business, announced significant advances in the Analog FastSPICE Platform with the introduction of Analog FastSPICE eXTreme technology for nanometer-scale verification of large, post-layout analog designs. Analog FastSPICE eXTreme includes revolutionary technology that can substantially boost simulation performance, while helping maintain the foundry-certified accuracy required for nanometer-scale analog verification. Analog FastSPICE eXTreme is especially […]
Multi-board EDA software highlights schematic design, FPGA optimization, skew group routing
Zuken announces the CR-8000 2020 release of its advanced 3D multi-board EDA environment. The latest release was developed in close collaboration with Zuken’s global customers in business sectors, including electronics, high tech, automation, automotive, aerospace, and defense. As product complexity increases, these businesses are searching for opportunities to increase design performance and process resilience. Valuable […]
Enterprise software enables design and validation of PCB stackups
Z-zero announces the release of Z-planner Enterprise, a field-solver based stackup planning and material selection software that is optimized for front-to-back PCB design and signal-integrity flow. Z-planner Enterprise is an all-in-one solution that enables hardware design teams to design and validate PCB stackups. With interfaces to the most common PCB layout and signal-integrity design flows, […]
Free PCB design software enhanced with new features
RS Components (RS) has released the latest version of its free DesignSpark PCB software for users in North America. DesignSpark PCB 9.0 is the latest version of the popular online design tool available to members of the DesignSpark online engineering community. New functionality now available in version 9.0 includes the ability to detect dangling connections, add copper pour to […]
Upgraded PCB design software now handles blind/buried vias, complex spacing rules
In conjunction with the official launch of its DesignSpark online engineering and design community in North America, RS Components (RS) is debuting DesignSpark PCB Pro, a professional-level upgrade to its already popular free online PCB design tool, DesignSpark PCB. DesignSpark PCB is a free-to-use electronic computer-assisted design (ECAD) rapid prototyping tool offering workflow integration; unlimited […]
Simulation software models electrostatic discharge tests
Remcom announces the ability to simulate electrostatic discharge (ESD) testing in the latest release of XFdtd 3D EM Simulation Software, enabling engineers to identify potential locations of dielectric breakdown and components at risk of damage in their device designs. For less obvious damage this pre-prototype insight is especially valuable, as it enables optimized ESD mitigation […]
Simulation software handles high-frequency electromagnetics
Siemens Digital Industries Software announces today the latest version of Simcenter 3D software, with major enhancements for low- and high-frequency electromagnetic solutions to help accelerate electromagnetics simulation processes. The latest version advances simulation capabilities with increased multidisciplinary integration capabilities, faster CAE process, increased openness and scalability, and enhanced capabilities to integrate with the digital thread. […]
New software facilitates multi-discipline
collaboration for multi-board systems
New design software aims to enable a seamless concurrent collaboration among multi-discipline teams working on multi-board designs. Called Xpedition, the software was developed by Mentor Graphics Corp. It is said to eliminate redundant effort during the design process and to optimize product performance and reliability with a data management infrastructure. The result is better data […]
