Siemens has introduced the Questa One Agentic Toolkit, adding domain-scoped agentic AI workflows to its verification portfolio to improve RTL design and verification efficiency. The toolkit deploys autonomous agents for RTL code generation, linting, clock-domain crossing analysis, verification planning, and debug. These agents operate within defined governance boundaries and integrate directly with existing verification tools, […]
Spring pin test socket supports –40 °C to +150 °C DFN2 device testing
Ironwood Electronics has released a new spring pin test socket for DFN2 packages. The socket is engineered to support up to 500,000 actuation cycles and delivers electrical performance of –1 dB at 60 GHz. The design accommodates operating temperatures from –40 °C to +150 °C, enabling extended evaluation across a broad thermal range. Mechanical construction […]
Engineering tools for AI and software-defined vehicles
At CES 2026, Synopsys is presenting systems-to-silicon engineering solutions to support AI-driven, software-defined automotive development workflows. The company’s portfolio spans intelligent system-level simulation, silicon design tools, virtualization technologies, and digital prototyping that aim to help automakers and suppliers predict performance, reduce physical prototyping costs, and shorten development cycles. Synopsys solutions, such as virtualizer development kits, […]
Integrated DSP functions reduce external processing requirements
The Plural-DSP analog-to-digital converter family from Silanna Semiconductor integrates a proprietary converter core with on-chip DSP to reduce system complexity in signal-chain designs. Available in 12-, 14-, and 16-bit resolutions with sampling rates from 5 to 250 MSPS, the Plural-DSP ADC family supports functions such as decimation, digital down-conversion, interleaving, and IQ-mismatch correction, eliminating the […]
Manual-actuated QFN24 socket supports solderless device evaluation
Ironwood Electronics has released a test socket designed for QFN24 devices that uses a double-latch manual actuator. The socket is intended to support device evaluation, characterization, screening, and other lab or production-adjacent test workflows where repeatable contact and quick device changeover are required. The double-latch actuation mechanism is designed to apply controlled compression during clamping, […]
Near-zero-footprint SMT elastomer socket introduced for BGA264 devices
Ironwood Electronics has introduced a new near-device-footprint surface-mount (SMT) elastomer socket designed for BGA264 packages. The socket supports mixed-pitch configurations of 0.6 × 0.675 millimeters and a device size of 8.7 × 14.4 millimeters, providing a compact layout with high electrical performance. The design enables the socket to be reflow-mounted onto the same printed circuit […]
Thermal system supports low-power devices under 10 W load
Ironwood Electronics has introduced the Imperium line of thermal control systems designed for temperature characterization of semiconductor devices across a range of −55 °C to +155 °C. The initial model supports devices with power dissipation below 10 W and achieves a temperature ramp rate of 80 °C per minute. The system is engineered to maintain […]
4 GHz elastomer socket Introduced for BGA1440 with –1 dB insertion loss
Ironwood Electronics introduces a new elastomer-based socket solution targeting high-frequency BGA devices. The 94 GHz elastomer socket is designed for BGA1440 packages and enables signal paths with roughly –1 dB insertion loss at 94 GHz between each ball and the printed circuit board. The socket employs a swivel-lid compression mechanism to simplify device insertion and […]
94 GHz BGA400 socket boasts 12 W power dissipation
Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 94 GHz bandwidth, very low inductance and wide temperature applications. The new GT-BGA socket is specifically designed for BGA400 package configurations and operates at bandwidths up to 94GHz with less than 1dB of insertion loss while supporting enhanced power […]
Socket supports up to 40 GHz performance at –1 dB for high-frequency testing
Ironwood Electronics has released the Grypper chip‑size socket for 0.5 mm‑pitch BGA35 packages. Sized to match the target IC (“zero footprint”), the socket mounts directly on the same PCB area during reflow without expanding the board layout. The Grypper enables rapid device exchange for development, sorting, and failure analysis by allowing snap‑in insertion without a lid. […]
