Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturized logic ICs are essential for space-constrained applications including sophisticated automotive applications such as chassis safety systems, battery monitoring, infotainment units, and advanced driver assistance systems (ADAS). MicroPak XSON5 is a thermally enhanced plastic enclosure with a 75% smaller PCB […]
Tools
AI design platform links engineers to electronic component options
CELUS announced the global release of its AI-assisted hardware design platform that helps engineers identify components for their projects through algorithms and machine learning. The CELUS Design Platform converts technical requirements into schematic prototypes, reducing the electronics design timeline to under an hour. The platform enables developers and engineers to move electronics projects from concept to […]
Electronic design platform connects cloud resources to PCB workflows
Siemens Digital Industries Software has announced the latest advancement in its electronic systems design portfolio. The new release integrates Xpedition software, Hyperlynx software, and PADS Professional software into a unified user experience with cloud connectivity and AI capabilities to advance innovation in electronic systems design. The electronic systems design industry faces challenges including engineering talent shortages, […]
Electronics design platform integrates mechanical and software development
Altium announces three new products at electronica 2024, centered around a cloud-based electronics design and supply chain platform. The flagship product, Altium Discover, connects semiconductor manufacturers, distributors, and product developers through integrated workflow tools. Built on Altium 365’s cloud infrastructure, Discover enables real-time collaboration across the electronics supply chain. The platform features digital rights management […]
Virtual platform suite addresses chip design workflow
Siemens Digital Industries Software has released the Innexis product suite to complement its Veloce hardware-assisted verification and validation system. The Innexis suite addresses software development needs in early IC development phases through three core products. The suite enables hardware/software development flow from virtual to hybrid to full RTL, provides an architecture native virtual platform, and […]
13 mm x 13 mm surface mount speaker runs at 8 Ohms
Same Sky’s Audio Group announced the addition of two surface mount models to its speakers product portfolio. The CMS-131304-SMT-TR and CMS-151504-SMT-TR are surface-mount miniature speakers, housed in compact 13 x 13 x 4 mm and 15 x 15 x 4 mm square frame packages, respectively. Both models are reflow solder compatible while featuring polyurethane cones and […]
New collaboration brings industry-grade chip fabrication to Georgia Tech students
Georgia Institute of Technology’s School of Electrical and Computer Engineering (ECE) and Texas Instruments (TI) have announced a strategic collaboration to advance analog circuit education and prepare students for the growing demand in the semiconductor industry. The collaboration centers around the launch of a new course, ECE 4804: Analog VLSI (Very-Large-Scale Integration) I: Tapeout, which […]
Chip resistors feature tight tolerances for automotive applications
Bourns, Inc. announced its AEC-Q200 compliant, automotive-grade thin film chip resistor model series. The Model CRT-A Series provides higher resistance tolerance accuracy and Temperature Coefficient of Resistance (TCR) compared to traditional through-hole type resistors. The new series delivers enhanced signal quality and is offered in an SMD package. These compact, yet high power-rated resistors offering accurate […]
Amplifiers support high-speed data communications in defense and aerospace
Qorvo has announced three new MMIC power amplifiers specifically designed for Ku-Band satellite communications (SATCOM) terminals. These amplifiers are part of a family of devices aimed at enhancing performance and efficiency in satellite uplink systems, supporting the increasing demand for high-speed data communications in defense and aerospace applications. The amplifier family offers output power ranging […]
Eco-friendly radio wave absorbers manufactured with biomass material
TDK Corporation has launched the IS-BP series of radio wave absorbers, incorporating over 25 wt% of biomass material to offer an environmentally sustainable option that facilitates CO₂ reduction. Mass production of this series began in April 2024. Microwave anechoic chambers, used for evaluating antennas, wireless communication equipment, and millimeter-wave radar for AD and ADAS, have […]
