Diodes Incorporated introduces the PAM8965 Class-D stereo audio power amplifier with an integrated synchronous boost converter. This high-efficiency device is targeted for use in AI-enabled speaker systems and portable musical instruments – where elevated output power, extended battery life, and compact construction are all key requirements. Running off a 2.8V to 8.5V supply, the PAM8965 has […]
Tools
Tiny AEC-Q200 qualified film capacitors feature highest IEC robustness classification
KEMET announces its new R53 series of miniature, polypropylene film X2 EMI (electromagnetic interference) suppression capacitors. This series fulfills the growing need for automotive, industrial, consumer, and energy applications that require a smaller, high-capacitance X2 class solution for suppressing EMI. The R53 series offers capacitance values from 0.1µF to 22µF, lead-spacing from 15mm to 37.5mmm, […]
Dual-band WiFi antennas optimized for 2.4GHz and 5GHz applications
AVX Corporation released a new series of IP67-rated, external, dual-band Wi-Fi antennas optimized for 2.4GHz and 5GHz applications. The new X9001748 Series external, dual-band Wi-Fi antennas have a standardized, ready-to-use, RoHS-compliant design with IP67 sealing for reliable outdoor operation and provide high-gain, high-efficiency, and high-reliability performance in low- and high-band applications with a variety of device configurations and […]
Single-chip AFE integrates optical, ECG, and bio-impedance measurement systems
Simplify the design of wearable remote patient monitoring (RPM) devices by measuring four vital signs with one MAX86178 triple-system vital signs analog front end (AFE) from Analog Devices, Inc. This single-chip AFE integrates three measurement systems (optical, ECG, and bio-impedance) to obtain four common vital signs: electrocardiogram (ECG or EKG), heart rate (ECG or optical […]
Thermal dielectric filler eliminates contamination in high-voltage applications
Henkel announced the commercial launch of Bergquist Gap Filler TGF 3000SF, the latest in the company’s line of silicone-free thermal interface materials (TIMs). With significantly higher thermal conductivity than any previous silicone-free liquid formulation in its portfolio and delivering impressive dielectric strength, Henkel’s new material extends wider market opportunities and production flexibility to manufacturing operations […]
Automotive-grade polymer chip caps exhibit low DCL, benign failure mode
AVX Corporation released the new TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX’s field-proven TCQ Series automotive […]
MLCCs feature low-resistance soft termination
TDK Corporation has expanded its CN series of multilayer ceramic capacitors (MLCCs) that are the first of their kind. The new products, 10 μF capacitance in 3216 size (3.2 x 1.6 x 1.6 mm) and 22 μF capacitance in 3225 size (3.2 x 2.5 x 2.5 mm), offer low-resistance soft termination with low terminal resistance […]
Small nichrome chip resistors handle 0.05 W
As design engineers continue to push the miniaturization of electronic devices while maintaining or increasing functionality, there is a corresponding need for smaller and more precise electronic components, such as chip resistors. If a precision application requires both small size and high-power handling, finding suitable precision resistors may be challenging. Stackpole recently increased the power […]
PCB design software features enhanced design rules, via handling
Number One Systems announced the release of Easy-PC version 25, with over 25 new technology features based on user requests from professional PCB designers. Easy-PC has been created by a team of engineering professionals who have rewritten the rule book for EDA tools to provide the optimal design experience. Easy-PC is packed with time-saving features […]
Phased-array antennas optimized for satellites, space vehicles
ThinKom Solutions announced the development of a new family of phased-array antennas for deployment on satellites and other space vehicles. The antennas are based on ThinKom’s proven VICTS (Variable Inclination Continuous Transverse Stub) technology. The multi-frequency full-duplex antennas are designed for operation on geostationary and non-geostationary satellites using C-, X-, Ku-, Ka-, Q-, V-, E- and […]
