Schurter continues to meet today’s increasing demand for smaller electronic equipment with the launch of its 5121 filtered appliance inlet. The new, compact filter series features an IEC C14 inlet with capacitors and a fully enclosed steel housing that reliably shields high-frequency interference conducted through cables or radiated interference. Especially suited for applications with […]
Capacitors
Polymer chip capacitors now offer 35 Vdc ratings
The XMPL Polymer Chip Capacitor Series has been expanded to match applications with higher voltage and capacitance requirements. Their excellent capacitance and voltage stability with temperature and frequency make these conductive polymer capacitors ideal for applications where bulk storage and high ripple current filtering are needed. Possessing much lower ESR and a shorter height profile […]
Tantalum capacitors meet MIL-PRF-39006 specs
Exxelia is expanding its line of MIL-PRF-39006/22 & MIL-PRF-39006/25 tantalum capacitors, with the support of the reliability level R. Exxelia now offers the reliability level R, in addition to levels M and P for the specifications MIL-PRF-39006/22 & MIL-PRF-39006/25, equivalent to CLR79 and CLR81 series. Available in all package sizes (T1 to T4), these fully sealed products […]
Automotive-grade three-terminal MLCC provides 4.3 µF in a 0402-in size.
Murata today announced it has set a new capacitor performance benchmark with the introduction of its NFM15HC435D0E3. The product is the world’s first automotive-grade three-terminal multi-layer ceramic capacitor (MLCC) to provide a capacitance of 4.3 µF in a 0402-inch (1.0 × 0.5 mm) size. It also delivers superior power decoupling and noise removal, which are […]
MLCCs handle 150℃ for automotive apps
Samsung Electro-Mechanics announced on the 11th that it has developed 13 types of automotive MLCCs with guaranteed use in a 150℃ environment with plans to supply them to global auto parts manufacturers. High-reliability automotive MLCCs with guaranteed use at 150℃ have been produced only by some companies, but with this development, Samsung Electro-Mechanics will step up […]
Super-high energy density film capacitors save space and weight
Exxelia introduced Miniature Micro-Layer (MML) capacitors, a breakthrough technology that allows tremendous size and weight reduction thanks to an unrivaled energy density. The energy density of 400 J/dm3 allows for a reduction in size and weight compared to traditional Polypropylene or Polyester dielectrics, together with an increased operating temperature up to 140°C and transient voltage […]
Tiny AEC-Q200 qualified film capacitors feature highest IEC robustness classification
KEMET announces its new R53 series of miniature, polypropylene film X2 EMI (electromagnetic interference) suppression capacitors. This series fulfills the growing need for automotive, industrial, consumer, and energy applications that require a smaller, high-capacitance X2 class solution for suppressing EMI. The R53 series offers capacitance values from 0.1µF to 22µF, lead-spacing from 15mm to 37.5mmm, […]
Automotive-grade polymer chip caps exhibit low DCL, benign failure mode
AVX Corporation released the new TCO Series high-temperature, automotive-grade polymer chip capacitors, which are rated for operating temperatures up to 150°C at category voltage and meet AEC-Q200 Stress Test Qualification for Passive Components requirements, which ensure stable performance at 85°C, 85% relative humidity, and rated voltage for up to 1,000 hours. Based on AVX’s field-proven TCQ Series automotive […]
MLCCs feature low-resistance soft termination
TDK Corporation has expanded its CN series of multilayer ceramic capacitors (MLCCs) that are the first of their kind. The new products, 10 μF capacitance in 3216 size (3.2 x 1.6 x 1.6 mm) and 22 μF capacitance in 3225 size (3.2 x 2.5 x 2.5 mm), offer low-resistance soft termination with low terminal resistance […]
Pin packages for standard logic devices enable large logic functions to be included in small form factor systems
Nexperia announced the world’s smallest and lowest profile 14,16, 20, and 24 pin packages for standard logic devices. For example, the 16 pin DHXQFN package is 45% smaller than the industry-standard DQFN16 leadless device. Not only has it a smaller footprint compared to competitors, but the new package also offers a 25% saving in the PCB […]
