A new BGA socket addresses high-performance requirements for MCUs. Called the CBT-BGA-6084, the socket contactor is a stamped spring pin with a 31-gm actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss < 1 dB at 15.7 GHz, and contact resistance is
IC sockets
Stamped-spring pin socket for 1-mm-pitch Mobility Radeon 9000
A new socket addressing high-performance requirements for Burn-in and Test applications is called the SBT-BGA-6558. The contactor is a stamped-spring pin with 31-g actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is less than 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
BGA SMT emulation adapter set allows affordable, reliable socketing of BGA1089 ICs
The SF-BGA1089C-B-42F and LS-BGA1089C-41 BGA SMT adapter set enables a low-cost and reliable socket for 1089 pin BGA ICs. The adapter pair consists of the SF-BGA1089C-B-42F, patented female sockets with machined pins epoxy over-molded into an assembly that matches the male pin LS-BGA1089C-41. The epoxy over molded SF-BGA1089C-B-42F is soldered to a PCB using standard […]
Removable lid spring pin socket handles DDR memory
A new BGA socket addresses high-performance requirements for DDR. Called the CBT-BGA-6081, the contactor is a stamped spring pin with 31-g actuation force per pin and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.88 nH, insertion loss is below 1 dB at 15.7 GHz, and capacitance is 0.097 pF. The current […]
BGA socket adapter handles 256-pin, 1-mm pitch Xilinx FPGAs
A new high-performance BGA Socket Adapter called the LS-BGA256E-15 allows users to convert a compression-mount BGA socket which needs mounting holes (in the target PCB) into a version for conventional through-hole soldering options. The adapter consists of machined-brass pins pressed into an FR4 wafer. The top side of the adapter has gold-plated pads to receive […]
30 GHz BGA socket for BGA169 packages
A new high-performance BGA socket for 0.5-mm-pitch BGA 169 pin devices called the CG-BGA-5027 socket is designed for a 7×7-mm package size and operates at a bandwidth up to 30 GHz with less than 1 dB of insertion loss. The socket is designed with an easy open clamshell lid with integrated compression mechanism. The contact […]
Stamped spring pin socket for 0.8-mm pitch Infineon LFBGA
A new socket addressing high-performance requirements for Burn-in and Test applications is called the SBT-BGA-6553. The contactor is a stamped-spring pin with 31-gm actuation force per ball and cycle life of 125,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss is < 1 dB at 15.7 GHz, and capacitance 0.097 pF. […]
Clamshell lid socket for QFN16 packages works at up to 44 GHz
A new QFN socket design using high-performance elastomer capable of 44 GHz, low inductance, high endurance, and wide temperature applications. The SM-QFN-9026 socket is designed for 3×4-m package sizes and operates at bandwidths up to 44 GHz with less than 1 dB of insertion loss. The socket is also designed to dissipate few watts with […]
BGA socket for FCBGA955 packages handles 75-GHz signals
A new BGA socket design from Ironwood Electronics uses high-performance elastomer capable of 75 GHz, while exhibiting low inductance and operating over a wide temperature range. The GT-BGA-2086 socket is designed for a 21×21-mm package size and operates at bandwidths up to 75 GHz with less than 1 dB of insertion loss. The socket is […]
Spring pin socket for DC/DC converters handles 25 A
A new socket addresses high current requirements for dual dc-dc converters. The SBT-DC/DC-9002 uses a contactor that is a spring pin with 136-gm actuation force per pin and cycle life of 250,000 insertions. The current capacity of each contactor is 25 A at 20°C temperature rise. Socket temperature range is -55 to +150°C. The socket […]
