onsemi announced the availability of the CEM102, a compact analog front-end (AFE) that enables electrochemical sensing with exceptional accuracy at very low currents. With its small form factor and industry-leading low power consumption, the CEM102 allows engineers to create versatile and compact solutions for industrial, environmental, and healthcare applications such as air and gas detection, […]
Wearables
IoT front end module designed in adherence to Thread and Matter
pSemi Corporation announced the introduction of their smallest PA-LNA-SW Internet of Things (IoT) front-end module (FEM): the PE562212. Designed in adherence to the Thread and Matter protocols, industry frameworks that focus on simplifying connected experiences, PE562212 is an ultra-compact multi-protocol 2.4 GHz FEM that enables a variety of connectivity options for IoT devices. With a […]
Filters limit EMI and audio distortion
TDK Corporation has announced the introduction of its compact MAF1005FR series of EMC components, measuring 1.0 mm (L) x 0.5 mm (W) x 0.5 mm (H). These multilayer chip components are designed to improve sound quality and reduce noise interference in the audio lines (sound lines) of smartphones and other devices such as tablets, wearables, […]
MEMS microphone trio address ear and wearables market
Knowles Corporation introduces its latest series of SiSonic MEMS microphones: Titan (Digital), Falcon (Differential Analog), and Robin (Single Ended Analog). The new trio of microphones provides advanced performance capabilities for space-constrained Ear and wearable applications like True Wireless Stereo (TWS) earbuds, smart watches, Augmented Reality (AR) glasses, and Virtual Reality (VR) headsets. Each of the […]
Wearable antennas target UWB frequencies
Antennaware Ltd, a company that specializes in solving the body-blocking problems normally associated with close-range RF designs, has launched a new addition to its Bodywave antenna range that specifically targets the Ultra Wide Band(UWB) radio market. Ideally suited to the IoT, wearable, sports, professional, and consumer electronics markets, Antennaware’s robust UWB Bodywave elevates wearable performance […]
What can you make with MEMS technology?
Microelectromechanical systems (MEMS) has several names, including micro-electro-mechanical systems, and micromechatronic systems. In Japan, MEMS is called micromachines, while in Europe, it’s referred to as microsystem technology (MST). Whatever name that’s used, MEMS devices are made using components measuring from 1 to 100 μm (0.001 to 0.1 mm), with MEMS devices ranging from 20 μm […]
Analog front end reduces, size, extends life of remote-patient monitoring devices
Reduce the size and extend the life of bioimpedance (BioZ) remote-patient monitoring (RPM) devices with the MAX30009 low-power, high-performance BioZ analog front-end (AFE) from Analog Devices, Inc. (ADI). For developers of small, battery-powered, continuously wearable devices, this AFE on a chip offers clinical-grade vital sign measurements of bioimpedance analysis for patient health assessment for wellness wearables and […]
Single-chip AFE integrates optical, ECG, and bio-impedance measurement systems
Simplify the design of wearable remote patient monitoring (RPM) devices by measuring four vital signs with one MAX86178 triple-system vital signs analog front end (AFE) from Analog Devices, Inc. This single-chip AFE integrates three measurement systems (optical, ECG, and bio-impedance) to obtain four common vital signs: electrocardiogram (ECG or EKG), heart rate (ECG or optical […]
What is passive intermodulation?
Passive intermodulation (PIM) is a pernicious and destructive phenomenon for cellular network operators. PIM shows up as a set of unwanted signals created by mixing two or more strong RF signals. Mixing generally produces the sum and difference frequencies of the two transmit signals F1 and F2. These signals are F1 + F2 and F1 […]
Ultraminiature multilayer ceramic chip inductors work up to 10 GHz
AVX Corporation released a new series of ultraminiature multilayer ceramic chip inductors for high-frequency RF applications. The new LCCI Series inductors are currently available in three standard EIA chip sizes — 0201, 0402, and 0603 — with tight-tolerance physical dimensions almost exclusively in the submillimeter range and tin-plated surface-mount terminations, enabling compatibility with high-density PCBs […]