By Jean-Marie Brunet, and Dr. Lauro Rizzatti, Siemens EDA Today, system-on-chip (SoC) devices permeate our world and propel numerous industries. They are integral for the internet of things (IoT), to power up complex 5G/6G wireless applications, sit at the core of artificial intelligence/machine learning (AI/ML) algorithmic processors, drive powerful data center computers and storage devices, […]
Data Center
24-bit wideband ADC offers data rates up to 400 kSPS
Texas Instruments introduced the smallest 24-bit wideband analog-to-digital converter (ADC) that delivers industry-leading signal-measurement precision at wider bandwidths than competing ADCs. The ADS127L11, the newest product in TI’s portfolio of precision wideband ADCs, achieves ultra-precise data acquisition in a 50% smaller package, significantly optimizing power consumption, resolution, and measurement bandwidth for a wide range of […]
EDA design tool bundle addresses component lead time and availability changes
EMA Design Automation and Digi-Key Electronics have collaborated to release the OrCAD Capture Bundle, a special offer available only on digikey. This new design bundle provides the tools, data, and models needed to ensure first-pass design success including OrCAD Capture, the industry-standard schematic design solution; In-design ability to search and select parts from Digi-Key; Searchable […]
New standard simplifies electronic device thermal model data sharing
Siemens Digital Industries Software announced the establishment of JEP181—a neutral file, XML-based standard from the JEDEC Solid State Technology Association, which is the global leader in standards development for the microelectronics industry. The JEP181 standard simplifies thermal model data sharing between suppliers and end-users in a single file format called ECXML (Electronics Cooling eXtensible Markup […]
SAE ADCs boast sampling speeds of 10 to 125 MSPS
Texas Instruments expanded its portfolio of high-speed data converters with a broad new family of successive approximation register (SAR) analog-to-digital converters (ADCs) that enable high-precision data acquisition in industrial designs. Featuring best-in-class dynamic range at the lowest power consumption, the ADC3660 family includes eight SAR ADCs in 14-, 16- and 18-bit resolution at sampling speeds […]
High-performance external antennas cover, GNSS, LTE, WiFi, GPS bands
AVX Corporation announces Ethertronics’ extensive range of high-performance, high-reliability external antennas designed to provide immediate, standardized solutions for a wide range of cross-market applications with challenging space, weight, and performance requirements. The nine antenna series offers a wide variety of small, low-profile form factors ruggedized and environmentally sealed for use in heavy-duty and harsh-environment applications. […]
PCIe 5.0 retimer technology enables data center system design up to 32 GT/s
Astera Labs Inc., a maker of purpose-built connectivity solutions for intelligent systems, announced the industry’s first Peripheral Component Interconnect PCI Express (PCIe) 5.0 retimer technology, specifically designed to remove performance bottlenecks and signal integrity challenges in next-generation servers. This breakthrough, system-aware technology makes it possible for hyperscale data center system designers to create a robust […]
PCIe Gen 4-compliant clock buffers powered from single 1.5 V/1.8 V supplies
Silicon Labs has introduced a new family of low-power PCI Express (PCIe) Gen 1/2/3/4 clock buffers that provide ultra-low jitter clock distribution in 1.5 V and 1.8 V applications. With additive jitter performance of 40 fs RMS (typical), Silicon Labs’ new Si532xx PCIe clock buffers provide more than 90 percent margin to stringent PCIe Gen 3 […]
QSFP28 2km CWDM4 and 10km 4WDM transceivers offer typical power consumption of 2.6W
ColorChip Ltd.will take part in a demonstration of a next-generation SDN platform using intelligent software-defined networks. ColorChip’s 100G QSFP28 2km CWDM4 and 10km 4WDM transceivers, used in Data Center Interconnect links, will be demonstrated in Caltech’s booth #663 on November 13th-17th during SuperComputing 2017 Exhibition in Denver, Colorado, USA. The exhibition of the Next Generation SDN architecture will employ a […]
